POWER CONVERSION DEVICE AND FABRICATING METHOD FOR THE SAME

• US 20090219696A1
• Filed: 03/08/2007
• Published: 09/03/2009
• Est. Priority Date: 03/30/2006
• Status: Active Grant

• Current Assignee: Mitsubishi Electric Corporation
• Original Assignee: Mitsubishi Electric Corporation
• Inventors: Nakayama, Yasushi, Toya, Kazuyoshi, Murahashi, Akihiro, Oi, Takeshi
• Granted Patent: US 7,881,086 B2
• Time in Patent Office: Days
• US Class Current: 361/709
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H02M 7/487 Neutral point clamped inverters

Abstract

A power conversion device in which the inductance of a main circuit is reduced, a surge voltage is suppressed, elements are properly cooled, which is miniaturized and reduced in weight as a whole, and is excellent in handling performance in a manufacturing process and a maintenance work. A positive side arm unit includes IGBT modules, a coupling diode module, a cooling plate on which the modules are mounted, and a first laminated bus bar connected to the respective modules. A negative side arm unit includes IGBT modules, a coupling diode module, a cooling plate on which the modules are mounted, and a second laminated bus bar connected to the respective modules, and both the laminated bus bars and the capacitors are connected to one another by a third laminated bus bar. Both the cooling plates are parallel to each other so that the mount surfaces thereof are set in the same direction.

Claims

1-12. -12. (canceled)

13. A power conversion device comprising:

a first semiconductor element connected between an AC terminal and a positive terminal of a DC power source and that constitutes a positive side arm, and a second semiconductor element connected between the AC terminal and a negative terminal of the DC power source and that constitutes a negative side arm, power conversion being performed between the DC power source and the AC terminal by turn-on/off operation of the semiconductor element;

a first cooling plate on which the semiconductor element constituting the positive side arm is mounted;

a second cooling plate disposed in parallel to the first cooling plate so that the mount surface thereof is set in the same direction as the first cooling plate and both cooling plates are laid overlapping each other; and

a laminated bus bar that connects the semiconductor element constituting the positive side arm and the DC power source, connects the semiconductor element constituting the negative side arm and the DC power source, connects the semiconductor element constituting the positive side arm and the semiconductor element constituting the negative side arm, and includes laminated electrically conductive bus bars with an insulating material sandwiched therebetween.

14. The power conversion device according to claim 13, wherein the DC power source further includes an intermediate terminal;

the positive side arm including a first switching element connected to a positive electrode terminal of the DC power source, a second switching element connected to the first switching element in series and connected to an alternating current terminal, and a first coupling diode connected between the intermediate connection point of the first and second switching elements and an intermediate terminal which are mounted as the semiconductor elements on a first cooling plate; and

the negative side arm including a third switching element connected to an alternating current terminal, a fourth switching element connected to the third switching element in series and connected to a negative electrode terminal of the DC power source, and a second coupling diode connected between the intermediate connection point of the third and fourth switching element and the intermediate terminal which are mounted as the semiconductor elements on a second cooling plate, three-level potentials of the positive electrode terminal, the intermediate terminal and the negative electrode terminal being output to the alternating current terminal by the turn-on/off operation of the switching elements.

15. The power conversion device according to claim 14, wherein when the connection to the DC power source is led out from one end side of the first and second cooling plates in an arrangement direction of the respective semiconductor elements, the first and fourth switching elements are arranged at farthest positions from the DC power source or the first and second coupling diodes are arranged at the farthest positions from the DC power source.

16. The power conversion device according to claim 13, wherein the positive side arm comprises a U-phase positive side switching element connected between a positive terminal of the DC power source and a U-phase AC terminal, a V-phase positive side switching element connected between the positive terminal of the DC power source and a V-phase AC terminal, and a W-phase positive side switching element connected between the positive terminal of the DC power source and a W-phase AC terminal which are mounted as the semiconductor elements on the first cooling plate, and

wherein the negative side arm comprises a U-phase negative side switching element connected between a negative terminal of the DC power source and the U-phase AC terminal, a V-phase negative side switching element connected between the negative terminal of the DC power source and the V-phase AC terminal, and a W-phase negative side switching element connected between the negative terminal of the DC power source and the W-phase AC terminal which are mounted as the semiconductor elements on the second cooling plate, 2-level potentials of the positive terminal and the negative terminal of the DC power source being output to the U-phase, V-phase and W-phase AC terminals of three phases by the turn-on/off operation of the switching elements.

17. The power conversion device according to claim 16, wherein when the connection to the DC power source is led out from one end side of the first and second cooling plates in the arrangement direction of the respective semiconductor elements, the negative side switching element whose phase type is the same as the positive side switching element disposed at the farthest position of the first cooling plate from the DC power source is disposed at a nearest position of the second cooling plate to the DC power source, and the negative side switching element whose phase type is the same as the positive side switching element disposed at the nearest position of the first cooling plate to the DC power source is disposed at a farthest position of the second cooling plate from the DC power source.

18. The power conversion device according to claim 13, wherein arrangements of the positive and negative electrodes of the semiconductor elements mounted on the first and second cooling plates are opposite to each other between the first cooling plate and the second cooling plate.

19. The power conversion device according to claim 13, wherein when the connection to the DC power source is led out from one end side of the first and second cooling plates in the arrangement direction of the respective semiconductor elements, the laminated bus bar includes a first laminated bus bar for leading out the potential of the semiconductor elements mounted on the first cooling plate to the connection portion located at one end side of the cooling plate, a second laminated bus bar for leading out the potential of the semiconductor elements mounted on the second cooling plate to the connection portion located at one end side of the cooling plate, and a third laminated bus bar for connecting the connection portion of the first laminated bus bar, the connection portion of the second laminated bus bar, and the DC power source.

20. The power conversion device according to claim 19, wherein the first and second laminated bus bars are constructed so that portions thereof are designed in a planar shape parallel to the parallel surfaces of the cooling plates and lead out the potentials of the semiconductor elements to the connection portions, and the planar connection portions thereof are formed in an L-shape so as to be bent at a right angle in the same direction, and the third laminated bus bar is constructed in a planar shape parallel to both the connection portions.

21. A power conversion device comprising:

a 3-level power conversion device and a 2-level power conversion device claimed in claim 13 that are arranged so that all the cooling plates are parallel to one another and the mount surfaces of the semiconductor elements thereof are set in the same direction, thereby constructing a converter for performing conversion of AC-DC-AC.

22. A method of fabricating the power conversion device according to claim 20, comprising:

first connecting the semiconductor elements mounted on the first cooling plate to the first laminated bus bar;

second connecting the semiconductor elements mounted on the second cooling plate to the second laminated bus bar; and

third connecting the connection portions of the first and second laminated bus bars to the third laminated bus bar after the first and second connectings.

23. A power conversion device comprising:

a U-phase positive side switching element connected between a positive terminal of a DC power source and a U-phase AC terminal, a V-phase positive side switching element connected between the positive terminal of the DC power source and a V-phase AC terminal, and a W-phase positive side switching element connected between the positive terminal of the DC power source and a W-phase AC terminal as a semiconductor element constituting a positive side arm; and

a U-phase negative side switching element connected between a negative terminal of the DC power source and the U-phase AC terminal, a V-phase negative side switching element connected between the negative terminal of the DC power source and the V-phase AC terminal, and a W-phase negative side switching element connected between the negative terminal of the DC power source and the W-phase AC terminal as a semiconductor element constituting a negative side arm, 2-level potentials of the positive terminal and the negative terminal of the DC power source being output to the U-phase, V-phase and W-phase AC terminals of three phases by the turn-on/off operation of the switching elements;

comprising;

a first cooling plate on which positive side and negative side switching elements of any one phase of the three phases of U, V and W and a positive side or negative side switching element of any one phase of the other two phases are mounted;

a second cooling plate that is disposed in parallel to the first cooling plate so that the mount surface thereof is set in the same direction as the first cooling plate and both cooling plates are laid overlapping each other, and a negative side or positive side switching element of any one phase of the other two phases which is not mounted on the first cooling plate, and positive side and negative side switching elements of the other phase of the other two phases are mounted; and

a laminated bus bar that connects the switching element constituting the positive side arm and the DC power source, connects the switching element constituting the negative side arm and the DC power source, and connects the semiconductor element constituting the positive side arm and the semiconductor element constituting the negative side arm, and includes laminated electrically conductive bus bars so that an insulating material is sandwiched therebetween.

24. The power conversion device according to claim 23, wherein when the connection to the DC power source is led out from one end side of the first and second cooling plates in the arrangement direction of the respective semiconductor elements, the positive side and negative side switching elements of any one phase of the other two phases are disposed at a nearest position to the DC power source.

25. The power conversion device according to claim 23, wherein arrangements of the positive and negative electrodes of the semiconductor elements mounted on the first and second cooling plates are opposite to each other between the first cooling plate and the second cooling plate.

26. The power conversion device according to claim 23, wherein when the connection to the DC power source is led out from one end side of the first and second cooling plates in the arrangement direction of the respective semiconductor elements, the laminated bus bar includes a first laminated bus bar for leading out the potential of the semiconductor elements mounted on the first cooling plate to the connection portion located at one end side of the cooling plate, a second laminated bus bar for leading out the potential of the semiconductor elements mounted on the second cooling plate to the connection portion located at one end side of the cooling plate, and a third laminated bus bar for connecting the connection portion of the first laminated bus bar, the connection portion of the second laminated bus bar, and the DC power source.

27. The power conversion device according to claim 26, wherein the first and second laminated bus bars are constructed so that the portions thereof are designed in a planar shape parallel to the parallel surfaces of the cooling plates and lead out the potentials of the semiconductor elements to the connection portions, and the planar connection portions thereof are formed in an L-shape so as to be bent at a right angle in the same direction, and the third laminated bus bar is constructed in a planar shape parallel to both the connection portions.

28. A power conversion device comprising:

a 3-level power conversion device and a 2-level power conversion device claimed in claim 23 that are arranged so that all the cooling plates are parallel to one another and the mount surfaces of the semiconductor elements thereof are set in the same direction, thereby constructing a converter for performing conversion of AC-DC-AC.

29. A method of fabricating the power conversion device according to claim 27, comprising:

first connecting the semiconductor elements mounted on the first cooling plate to the first laminated bus bar;

second connecting the semiconductor elements mounted on the second cooling plate to the second laminated bus bar; and

third connecting the connection portions of the first and second laminated bus bars to the third laminated bus bar after the first and second connectings.