SUBMOUNT AND ITS MANUFACTURING METHOD
First Claim
1. A submount including a first substrate having optical device mounting parts for mounting optical devices and a wiring part for supplying power to the optical devices which are formed on a main surface thereof, and a second substrate composed of a glass substrate having a through hole formed therein, the first substrate and the second substrate joined together such that the optical device mounting parts of the first substrate are aligned inside the through hole of the second substrate, wherein the first substrate is composed of a substrate containing an insulating material as a main component,the wiring parts are a metallized electrode having first wiring parts supplying power to one electrode terminal of each of the optical devices mounted on the optical device mounting parts, and second wiring parts provided adjacent to the first wiring parts and supplying power to another electrode terminal of each of the optical devices, andthe joining of the first substrate and the second substrate is performed by anodic bonding of a metallized joint provided in a region other than a region where the wiring part is exposed on the main surface of the first substrate.
1 Assignment
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Accused Products
Abstract
Submounts for mounting optical devices which have an excellent heat radiating property and can be formed in a wafer state in batch are provided.
A metallized electrode including optical device mounting parts and wiring parts is formed on a surface of a first substrate containing an insulating material as a main component, a through hole is formed in a glass substrate serving as a second substrate, the optical device mounting parts of the first substrate are aligned to be located inside the through hole of the second substrate, and the first substrate and the second substrate are joined together by use of a method such as anodic bonding.
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Citations
17 Claims
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1. A submount including a first substrate having optical device mounting parts for mounting optical devices and a wiring part for supplying power to the optical devices which are formed on a main surface thereof, and a second substrate composed of a glass substrate having a through hole formed therein, the first substrate and the second substrate joined together such that the optical device mounting parts of the first substrate are aligned inside the through hole of the second substrate, wherein the first substrate is composed of a substrate containing an insulating material as a main component,
the wiring parts are a metallized electrode having first wiring parts supplying power to one electrode terminal of each of the optical devices mounted on the optical device mounting parts, and second wiring parts provided adjacent to the first wiring parts and supplying power to another electrode terminal of each of the optical devices, and the joining of the first substrate and the second substrate is performed by anodic bonding of a metallized joint provided in a region other than a region where the wiring part is exposed on the main surface of the first substrate.
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13. A method of manufacturing a submount, comprising:
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forming a pattern of a metallized electrode including first wiring parts and second wiring parts on a main surface of a first substrate containing an insulating material as a main component, the first wiring parts having optical device mounting parts on which optical devices are mounted and supplying power to one electrode terminal of each of the optical devices, and the second wiring parts provided adjacent to the first wiring parts and supplying power to another electrode terminal of each of the optical devices; forming a through hole in a laminated glass substrate obtained by joining a glass single plate or a glass plate with a silicon plate to be a second substrate; and anode bonding the first substrate and the second substrate in a state in which alignment has been performed such that the optical device mounting parts of the first substrate are located inside the through hole of the second substrate. - View Dependent Claims (14, 15, 16, 17)
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Specification