SUBMOUNT AND ITS MANUFACTURING METHOD

• US 20090219728A1
• Filed: 04/04/2007
• Published: 09/03/2009
• Est. Priority Date: 04/04/2006
• Status: Active Grant

• Current Assignee: Hitachi Kyowa Engineering Company Limited (Hitachi, Ltd.)
• Original Assignee: Institut Francais Du Petrole (IFP Energies Nouvelles), Institut National de La Recherche Agronomique
• Inventors: Takemori, Hideaki, Seki, Masatoshi, Matsushima, Naoki, Hata, Shohei, Sakamoto, Eiji
• Granted Patent: US 8,269,301 B2
• Time in Patent Office: Days
• US Class Current: 362/382
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 33/46 Reflective coating, e.g. dielectric Bragg reflector
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/641 characterized by the materials

Abstract

Submounts for mounting optical devices which have an excellent heat radiating property and can be formed in a wafer state in batch are provided.

A metallized electrode including optical device mounting parts and wiring parts is formed on a surface of a first substrate containing an insulating material as a main component, a through hole is formed in a glass substrate serving as a second substrate, the optical device mounting parts of the first substrate are aligned to be located inside the through hole of the second substrate, and the first substrate and the second substrate are joined together by use of a method such as anodic bonding.

Claims

1. A submount including a first substrate having optical device mounting parts for mounting optical devices and a wiring part for supplying power to the optical devices which are formed on a main surface thereof, and a second substrate composed of a glass substrate having a through hole formed therein, the first substrate and the second substrate joined together such that the optical device mounting parts of the first substrate are aligned inside the through hole of the second substrate, wherein the first substrate is composed of a substrate containing an insulating material as a main component,

the wiring parts are a metallized electrode having first wiring parts supplying power to one electrode terminal of each of the optical devices mounted on the optical device mounting parts, and second wiring parts provided adjacent to the first wiring parts and supplying power to another electrode terminal of each of the optical devices, and

the joining of the first substrate and the second substrate is performed by anodic bonding of a metallized joint provided in a region other than a region where the wiring part is exposed on the main surface of the first substrate.

2. The submount according to claim 1,

wherein on the main surface of the first substrate, the metallized joint is electrically separated from the wiring parts, is provided adjacent to the wiring part with a gap interposed therebetween, and extends in an outer circumference of the first substrate.

3. The submount according to claim 1,

wherein on the main surface of the first substrate, the metallized joint is provided without overlapping any one of the wiring parts.

4. The submount according to claim 1,

wherein the second substrate is composed of a laminated substrate formed by joining a glass plate and a silicon plate and is aligned so that the optical device mounting parts provided on the first substrate are located inside a through hole provided in the laminated substrate, and a glass plate of the first substrate and the second substrate are joined together.

5. The submount according to any one of claims 1 to 4,

wherein a bottom surface metallized electrode is formed on a surface, opposite to a surface where a metallized electrode constituting the wiring parts is formed, of the first substrate, and the metallized electrode and the bottom surface metallized electrode are electrically connected to each other through a through hole.

6. The submount according to any one of claims 1 to 4,

wherein a bottom surface metallized electrode is formed on a surface, opposite to a surface where a metallized electrode constituting the wiring parts is formed, of the first substrate, and the metallized electrode and the bottom surface metallized electrode are electrically connected to each other by a metallized layer process on a surface on a side of the first substrate.

7. The submount according to any one of claims 1 to 4,

wherein an outermost surface of a metallized joint formed on the first substrate is at least one kind of metal selected from a group including aluminum, titanium, zirconium, hafnium, tungsten, molybdenum, chromium, vanadium, magnesium, and iron.

8. The submount according to any one of claims 1 to 4,

wherein the first substrate is formed of a ceramic material containing at least one kind of silicon carbide, silicone nitride, aluminum nitride, and aluminum oxide as a main component.

9. The submount according to any one of claims 1 to 4,

wherein a member penetrating light of the optical devices mounted on the optical device mounting parts is joined on a top surface of the second substrate so as to suppress external air from permeating into a through hole of the second substrate.

10. The submount according to any one of claims 1 to 4,

wherein a planarized or smooth curved surface is formed on an internal surface of a through hole of the second substrate by forming a resin film or plating.

11. The submount according to any one of claims 1 to 4,

wherein a light reflecting film is formed on an internal surface of a through hole of the second substrate.

12. An optical module comprising:

optical devices mounted on the optical device mounting parts of the submount according to any one of claims 1 to 4.

13. A method of manufacturing a submount, comprising:

forming a pattern of a metallized electrode including first wiring parts and second wiring parts on a main surface of a first substrate containing an insulating material as a main component, the first wiring parts having optical device mounting parts on which optical devices are mounted and supplying power to one electrode terminal of each of the optical devices, and the second wiring parts provided adjacent to the first wiring parts and supplying power to another electrode terminal of each of the optical devices;

forming a through hole in a laminated glass substrate obtained by joining a glass single plate or a glass plate with a silicon plate to be a second substrate; and

anode bonding the first substrate and the second substrate in a state in which alignment has been performed such that the optical device mounting parts of the first substrate are located inside the through hole of the second substrate.

14. The method of manufacturing a submount according to claim 13,

wherein in the forming of the through hole in the second substrate, after an opening by a resist mask is formed, the through hole is formed in the second substrate by a sandblasting method.

15. The method of manufacturing a submount according to claim 13,

wherein in the forming of the through hole in the second substrate, a through hole is formed by a sandblasting method and then a reflective film is formed on the resist mask without removing the resist mask, and a reflective film is selectively formed inside the through hole by a lift-off method.

16. The method of manufacturing a submount according to claim 13,

wherein in the forming of the through hole in the second substrate, when a substrate is composed of a laminated glass substrate obtained by joining glass and silicon, after an opening is formed by the resist mask, a hole is formed in silicon by anisotropic wet etching, a resist mask is formed on a glass surface, a hole is formed in glass by etching, and a through hole is formed in the second substrate.

17. The method of manufacturing a submount according to claim 13,

wherein in the forming of the through hole in the second substrate, when a substrate is composed of a laminated glass substrate obtained by joining glass and silicon, after an opening is formed by the resist mask, a hole is formed in silicon by anisotropic wet etching, an opening by a resist mask is formed on a glass surface, a hole is formed in glass by a sandblasting method, and a through hole is formed in the second substrate.