HIGH-SPEED BANDPASS SERIAL DATA LINK

• US 20090220240A1
• Filed: 02/19/2009
• Published: 09/03/2009
• Est. Priority Date: 02/19/2008
• Status: Active Grant

• Current Assignee: McGill University
• Original Assignee: McGill University
• Inventors: SMITH, Nathan, SUNTIVES, Asanee, ABHARI, Ramesh, ROBERTS, Gordon W.
• Granted Patent: US 8,258,892 B2
• Time in Patent Office: Days
• US Class Current: 398/81
• CPC Class Codes: B82Y 20/00 Nanooptics, e.g. quantum optics or photonic crystals
• CPC Class Codes: G02B 6/125 Bends, branchings or intersections
• CPC Class Codes: H01P 3/121 integrated in a substrate
• CPC Class Codes: H01P 5/107 Hollow-waveguide/strip-line transitions
• CPC Class Codes: H04J 14/0298 with sub-carrier multiplexing [SCM]

Abstract

The present invention relates to a method and system for high-speed bandpass serial data communication. A driver receives at least one data signal and generates a bandpass data signal for transmission through a bandpass waveguide interconnect. The bandpass data signal is launched into the bandpass waveguide interconnect using a first adaptor and extracted therefrom after transmission using a second adaptor. A receiver connected to the second adaptor recovers the at least one data signal from the extracted bandpass data signal. A dispersion compensation circuit receives one of the at least one data signal and the bandpass data signal and information indicative of a phase response of the bandpass waveguide interconnect and dispersion compensates the one of the at least one data signal and the bandpass data signal by compensating the phase response of the bandpass waveguide interconnect.

Claims

1. An apparatus comprising:

a first port for receiving an input data signal comprising first data;

a bandpass waveguide interconnect having a phase response and for supporting propagation of a bandpass data signal within a predetermined frequency band along a predetermined path between a first location and a second location;

a first adaptor coupled to the bandpass waveguide interconnect for exciting an input bandpass data signal comprising the first data in the bandpass waveguide interconnect proximate the first location and propagating toward the second location; and

,

a second adaptor coupled to the bandpass waveguide interconnect for extracting an output bandpass data signal from the bandpass waveguide interconnect proximate the second location.

2. An apparatus according to claim 1 comprising:

a dispersion compensator for providing dispersion compensation to at least one of the input bandpass data signal and the output bandpass data signal for compensating for the phase response of the bandpass waveguide interconnect.

3. An apparatus according to claim 2 comprising:

a driver for receiving the input data signal and for generating a first signal for exciting the input bandpass data signal in dependence thereupon; and

a receiver coupled to the second adaptor for recovering the input data signal from the output bandpass data signal,

wherein the dispersion compensation circuit forms part of at least one of the driver and the receiver.

4. An apparatus according to claim 2 wherein the dispersion compensator comprises a passive filter.

6. An apparatus according to claim 2 wherein the dispersion compensator comprises a variation in an H-plane width of a portion of the bandpass waveguide interconnect for affecting dispersion thereof.

7. An apparatus according to claim 2 wherein the dispersion compensator comprises at least an optical component disposed for approximately equalizing dispersion of the bandpass waveguide interconnect.

8. An apparatus according to claim 3 wherein the driver comprises at least one of a serializer for serializing a plurality of received parallel data signals and a multiplexer for multiplexing a plurality of received parallel data signals, and wherein the receiver comprises at least one of a de-serializer for de-serializing the extracted baseband data signal and a a de-multiplexer for de-multiplexing the extracted baseband data signal.

9. An apparatus according to claim 2 wherein the bandpass waveguide interconnect comprises:

first and a second conducting layers disposed on opposing sides of a dielectric substrate;

a first set of inter-layer conductors connecting the first and the second conducting layers, the first set disposed along a first path; and

,

a second set of inter-layer conductors disposed along a second path spaced apart from the first path and forming a bounded region having a cross section defined by the first and second conducting layers on two sides and by the first and second set of inter-layer conductors on two other sides thereof.

10. An apparatus according to claim 1 wherein the bandpass waveguide interconnect comprises:

first and a second conducting Layers disposed on opposing sides of a dielectric substrate;

a first set of inter-layer conductors connecting the first and the second conducting layers, the first set disposed along a first path; and

,

a second set of inter-layer conductors disposed along a second path spaced apart from the first path and forming a bounded region having a cross section defined by the first and second conducting layers on two sides and by the first and second set of inter-layer conductors on two other sides thereof wherein the first path and the second path are separated by an approximately uniform distance along a length thereof.

11. An apparatus according to claim 10 wherein the first path and the second path other than follow a straight line.

12. An apparatus according to claim 11 wherein the first path and the second other path each comprise a bend of approximately 90 degrees.

13. An apparatus according to claim 12 wherein the first set of

inter-layer conductors forming an outside right-angle corner has an additional inter-layer conductor disposed therein inside the right angle corner thereof and the second set of inter-layer conductors has a substantially right-angle corner facing the outside right-angle corner.

14. An apparatus according to claim 12 wherein the first set of inter-layer conductors forms a chamfered bend and the second set of inter-layer conductors forms a right-angle corner absent a inter-layer conductors disposed at the point thereof.

15. An apparatus according to claim 12 wherein the first set of inter-layer conductors forms a curved path and the second set of inter-layer conductors forms an approximately right-angle corner.

16. An apparatus according to claim 10 comprising:

a second bandpass waveguide interconnect for having a second data signal propagating therein along a predetermined path within the dielectric substrate, the second bandpass waveguide interconnect comprising;

the first and a second conducting layers; and

,

a third set of inter-layer conductors connecting the first and the second conducting layers, the third set of inter-layer conductors disposed for forming the second bandpass waveguide between the third set of inter-layer conductors and the second set of inter-layer conductors.

17. An apparatus according to claim 16 comprising:

a third bandpass waveguide interconnect for having a third data signal propagating therein along a predetermined path within the dielectric substrate, the third bandpass waveguide interconnect comprising;

the first and a second conducting layers; and

,

a fourth set of inter-layer conductors connecting the first and the second conducting layers, the fourth set of inter-layer conductors disposed for forming the third bandpass waveguide between the third set of inter-layer conductors and the fourth set of inter-layer conductors.

18. An apparatus according to claim 1 comprising:

a strip of a conductive material having a predetermined width for conducting a data signal, the strip of conductive material disposed along at least a portion of the predetermined path within the waveguide interconnect between a location proximate the first location and a location proximate the second location.

19. A device as defined in claim 1 wherein the bandpass waveguide interconnect comprises:

first and a second conducting layers disposed on opposing sides of a dielectric substrate;

a first set of inter-layer conductors connecting the first and the second conducting layers, the first set disposed along a first path;

a second set of inter-layer conductors disposed along a second path spaced apart from the first path and forming a bounded region having a cross section defined by the first and second conducting layers on two sides and by the first and second set of inter-layer conductors on two other sides thereof; and

,

a strip of a conductive material having a predetermined width for conducting a data signal, the strip of conductive material disposed along at least a portion of the predetermined path within the waveguide interconnect between the first and second sets of inter-layer conductors wherein the strip of a conductive material is routed into the bandpass waveguide interconnect through a gap in the first set of inter-layer conductors.

20. An apparatus according to claim 1 wherein the dielectric substrate comprises a flexible material forming a flexible dielectric substrate and wherein the resulting bandpass waveguide interconnect is flexible.

21. An apparatus according to claim 20 comprising a plurality of parallel bandpass waveguide interconnects disposed within the same flexible substrate forming a flexible ribbon.

22. An apparatus according to claim 1 wherein the bandpass waveguide interconnect comprises a substrate waveguide interconnect.

23. An apparatus according to claim 1 comprising:

a third adaptor coupled to the bandpass waveguide interconnect for exciting other input bandpass data signal comprising second data in the bandpass waveguide interconnect proximate the first location and propagating toward the second location; and

,

a fourth adaptor coupled to the bandpass waveguide interconnect for extracting an output bandpass data signal comprising the second data from the bandpass waveguide interconnect proximate the second location;

wherein the third adaptor and the first adaptor are each for exciting a different mode within the bandpass waveguide interconnect.

24. An apparatus according to claim 23 wherein the different modes consist of different TEm0 modes.

25. An apparatus according to claim 24 wherein the different modes consist of a TE10 and a TE20.

26. An apparatus according to claim 25 wherein the first adaptor comprises a inter-layer conductor transition for exciting the TE10 mode and the third adaptor is for providing two out of phase field vectors at an input port of the bandpass waveguide interconnect for exciting the TE20 mode.

27. An apparatus according to claim 26 wherein the third adaptor comprises two coplanar microstrip to field transitions.

28. An apparatus according to claim 27 comprising:

a set of inter-layer conductors disposed along a path for separating signals provided at each of the two coplanar microstrip to field transitions to prevent the TE10 transmission mode from propagating into the transition of the TE20 transmission mode.

29. An apparatus according to claim 26 wherein the third adaptor comprises two microstrip to field transitions on opposing conductive planes, the opposing conductive planes defining two opposing boundaries of the bandpass waveguide interconnect.

30. An apparatus according to claim 26 comprising a strip of a conductive material having a predetermined width for conducting a data signal, the strip of conductive material disposed along at least a portion of the predetermined path within the waveguide interconnect between a location proximate the first location and a location proximate the second location.

31. A device as defined in claim 24 wherein the bandpass waveguide interconnect comprises:

first and a second conducting layers disposed on opposing sides of a dielectric substrate;

a first set of inter-layer conductors connecting the first and the second conducting layers, the first set disposed along a first path; and

,

a second set of inter-layer conductors disposed along a second path spaced apart from the first path and forming a bounded region having a cross section defined by the first and second conducting layers on two sides and by the first and second set of inter-layer conductors on two other sides thereof.

5. An apparatus according to claim 5 wherein the dispersion compensator comprises one of a group-delay filter and a phase filter.

32. A method comprising:

receiving a data signal;

processing the data signal for generating a bandpass data signal within a predetermined frequency band;

launching the bandpass data signal into a bandpass waveguide interconnect at a first location, the bandpass waveguide interconnect for supporting propagation of the bandpass data signal within the predetermined frequency band from a first location to a second location;

extracting the bandpass data signal from the bandpass waveguide interconnect at a second location to provide an extracted bandpass data signal; and

,

processing the extracted bandpass data signal for recovering the data signal;

33. A method according to claim 32 comprising;

dispersion compensating one of the data signal and the extracted bandpass data signal by compensating the phase response of the bandpass waveguide interconnect.

34. A method according to claim 33 wherein dispersion compensating is performed prior to excitation of the bandpass data signal within the bandpass waveguide interconnect.

35. A method according to claim 33 wherein dispersion compensating is performed after extraction of the extracted bandpass data signal.

36. A method according to claim 33 comprising:

serializing a plurality of received parallel data signals to provide the data signal; and

,

de-serializing the extracted bandpass data signal.

37. A method according to claim 33 comprising;

multiplexing a plurality of received parallel data signals to provide the data signal; and

,

de-multiplexing the extracted bandpass data signal.

38. A method according to claim 32 comprising:

performing orthogonal frequency division multiplexing on the baseband data signal prior to providing same to the bandpass waveguide interconnect.

39. A method according to claim 32 comprising:

exciting within the bandpass waveguide interconnect two modes simultaneously, each mode excited for propagating to guide a signal comprising different data therein.

40. A method according to claim 39 wherein the two modes comprise a TEM mode and a TEm0 mode.

41. A method according to claim 39 wherein the two modes comprise two TEm0 modes.

42. A method according to claim 41 wherein the two modes comprise a TE10 mode and a TE20 mode.

43. A method according to claim 32 wherein the bandpass waveguide interconnect traverses an other than straight path from the first location to the second location.

44. A method according to claim 43 wherein the other than straight path from the first location to the second location comprises at least one right angle turn.

45. A method comprising:

receiving a plurality of data signals;

processing the plurality of data signals for generating a first bandpass data signal within a predetermined first frequency band and second bandpass data signal within a second predetermined frequency band;

launching the first bandpass data signal into a bandpass waveguide interconnect such that the first bandpass data signal is transmitted using a first transmission mode;

launching the second bandpass data signal into the same bandpass waveguide interconnect such that the second bandpass data signal is transmitted using a second other transmission mode, the first and second bandpass data signals propagating through the bandpass waveguide interconnect simultaneously;

extracting the first bandpass data signal from the bandpass waveguide interconnect;

extracting the second bandpass data signal from the bandpass waveguide interconnect; and

,

processing the extracted first and second bandpass data signal for recovering the plurality of data signals.