MANUFACTURING APPARATUS OF COMPOSITE SUBSTRATE AND MANUFACTURING METHOD OF COMPOSITE SUBSTRATE WITH USE OF THE MANUFACTURING APPARATUS

• US 20090223628A1
• Filed: 02/06/2009
• Published: 09/10/2009
• Est. Priority Date: 03/07/2008
• Status: Abandoned Application

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: MORIWAKA, Tomoaki, OHNUMA, Hideto
• Application Number:
  US12/366,728
• Publication Number:
  US 20090223628A1
• Time in Patent Office: Days
• US Class Current: 156/288
• CPC Class Codes: B32B 2309/02 Temperature
• CPC Class Codes: B32B 2309/08 Dimensions, e.g. volume
• CPC Class Codes: B32B 2309/105 Thickness
• CPC Class Codes: B32B 2309/72 For measuring or regulating, e.g. systems with feedback loops
• CPC Class Codes: B32B 2310/028 using vibration, e.g. sonic or ultrasonic
• CPC Class Codes: B32B 2310/0409 using liquids
• CPC Class Codes: B32B 2457/14 Semiconductor wafers
• CPC Class Codes: B32B 2457/20 Displays, e.g. liquid crystal displays, plasma displays
• CPC Class Codes: B32B 2457/202 LCD, i.e. liquid crystal displays
• CPC Class Codes: B32B 37/025 Transfer laminating
• CPC Class Codes: B32B 38/0012 Mechanical treatment, e.g. roughening, deforming, stretching
• CPC Class Codes: B32B 38/162 Cleaning
• CPC Class Codes: H01L 21/67046 using mainly scrubbing means, e.g. brushes
• CPC Class Codes: H01L 21/67092 Apparatus for mechanical treatment or grinding or cutting, see the relevant groups in subclasses B24B or B28D
• CPC Class Codes: H01L 21/67766 Mechanical parts of transfer devices robots in general in B25J

Abstract

A method for bonding a plurality of single crystal semiconductor substrates to a large supporting substrate such as a glass substrate while effectively aligning the substrates, and a method for reducing contaminants attached to a bonding surface during the bonding process. A plurality of single crystal semiconductor substrates are arranged on corresponding trays so that the front surfaces of the substrates face vertically downward, and a large supporting substrate is arranged so that the front surface thereof faces vertically upward. Next, the single crystal semiconductor substrates are spaced from the trays, and pressure is applied to part of each of the single crystal semiconductor substrates while the edges thereof are supported, whereby the front surfaces of the single crystal semiconductor substrates are bonded to the front surface of the large supporting substrate.

Claims

1. A manufacturing apparatus of a composite substrate, which comprises a plurality of first substrates being bonded to a second substrate, comprising:

a plurality of trays each for holding and fixing back surfaces of the plurality of first substrates;

a first stage, which includes and holds the plurality of trays so that front surfaces of the plurality of first substrates face vertically downward;

a second stage opposite to the first stage, which holds and fixes the second substrate so that a front surface of the second substrate faces vertically upward;

a stage driving portion for moving the first stage and the second stage so that the plurality of first substrates and the second substrate are brought close to each other; and

a pressure-applying mechanism for applying pressure to parts of the back surfaces of the plurality of first substrates while the first substrates and the second substrate are close to each other.

2. The manufacturing apparatus of the composite substrate, according to claim 1, wherein the pressure-applying mechanism is provided over the first stage.

3. The manufacturing apparatus of the composite substrate, according to claim 1, comprising a first transfer means and a second transfer means,

wherein the first transfer means has a means for transferring the plurality of first substrates to the tray;

and

wherein the second transfer means has a means for transferring the second substrate to the second stage.

4. The manufacturing apparatus of the composite substrate, according to claim 1, wherein the tray has a rotating means by which the plurality of first substrates supported with the front surfaces facing vertically upward are rotated so that the front surfaces thereof face vertically downward and supported.

5. The manufacturing apparatus of the composite substrate, according to claim 1, comprising a heat treatment means,

wherein the heat treatment means has a means for performing heat treatment on the plurality of first substrates and the second substrate.

6. The manufacturing apparatus of the composite substrate, according to claim 5, wherein the heat treatment means uses convection heating with gas.

7. The manufacturing apparatus of the composite substrate, according to claim 5, wherein the heat treatment means uses radiation from an element heated with Joule heat.

8. The manufacturing apparatus of the composite substrate, according to claim 1, comprising a means for cleaning one or both of the front surfaces of the plurality of first substrates and the front surface of the second substrate.

9. A manufacturing apparatus of a composite substrate, which comprises a plurality of first substrates being bonded to a second substrate, comprising:

a plurality of trays each for holding and fixing back surfaces of the plurality of first substrates;

a first stage, which includes and holds the plurality of trays so that front surfaces of the plurality of first substrates face vertically downward;

a second stage opposite to the first stage, which holds and fixes the second substrate so that a front surface of the second substrate faces vertically upward;

a stage driving portion for moving the first stage and the second stage so that the plurality of first substrates and the second substrate are brought close to each other;

a pressure-applying mechanism for applying pressure to parts of the back surfaces of the plurality of first substrates while the first substrates and the second substrate are close to each other; and

a heat treatment means for performing heat treatment on the plurality of first substrates and the second substrate, the heat treatment means comprising a heating gas supply unit, a temperature sensor, and a temperature control unit,

wherein the heating gas supply unit is controlled by the temperature sensor and the temperature control unit.

10. The manufacturing apparatus of the composite substrate, according to claim 9, wherein the pressure-applying mechanism is provided over the first stage.

11. The manufacturing apparatus of the composite substrate, according to claim 9, comprising a first transfer means and a second transfer means,

wherein the first transfer means has a means for transferring the plurality of first substrates to the tray;

and

wherein the second transfer means has a means for transferring the second substrate to the second stage.

12. The manufacturing apparatus of the composite substrate, according to claim 9, wherein the tray has a rotating means by which the plurality of first substrates supported with the front surfaces facing vertically upward are rotated so that the front surfaces thereof face vertically downward and supported.

13. The manufacturing apparatus of the composite substrate, according to claim 9, comprising a means for cleaning one or both of the front surfaces of the plurality of first substrates and the front surface of the second substrate.

14. A manufacturing method of a composite substrate, which comprises a plurality of first substrates being bonded to a second substrate, comprising the steps of:

arranging the plurality of first substrates on corresponding trays so that front surfaces of the plurality of first substrates face vertically downward;

arranging the second substrate on a second stage so that a front surface of the second substrate faces vertically upward; and

spacing the plurality of first substrates from the trays and applying pressure to parts of the plurality of first substrates while edges of the plurality of first substrates are supported, whereby the front surfaces of the plurality of first substrates are bonded to the front surface of the second substrate.

15. The manufacturing method of the composite substrate, according to claim 14,

wherein the trays are rotated after the plurality of first substrates are arranged on the corresponding trays so that the front surfaces of the plurality of first substrates face vertically upward;

and

wherein the plurality of first substrates are arranged on the corresponding trays so that the front surfaces of the plurality of first substrates face vertically downward.

16. The manufacturing method of the composite substrate, according to claim 14, wherein heat treatment is performed on the plurality of first substrates and the second substrate after the front surfaces of the plurality of first substrates are bonded to the front surface of the second substrate.

17. The manufacturing method of the composite substrate, according to claim 16, wherein the heat treatment is performed at a temperature of 150°

C. to 450°

C.

18. The manufacturing method of the composite substrate, according to claim 17:

wherein after the heat treatment is performed on the plurality of first substrates and the second substrate, heat treatment is performed at a temperature of 400°

C. to 750°

C. while the edges of the plurality of first substrates are supported; and

wherein the plurality of first substrates are spaced from the second substrate while being supported by the trays.

19. The manufacturing method of the composite substrate, according to of claim 14, wherein one or both of the front surfaces of the plurality of first substrates and the front surface of the second substrate is or are cleaned before the plurality of first substrates are bonded to the second substrate.