SEMICONDUCTOR CIRCUIT AND METHOD OF FABRICATING THE SAME
First Claim
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1. A bonded semiconductor structure, comprising:
- a support substrate which carries a first electronic circuit;
an interconnect region carried by the support substrate, the interconnect region including a capacitor and conductive line in communication with the first electronic circuit;
a bonding layer carried by the interconnect region; and
a bonded substrate coupled to the interconnect region through the bonding layer.
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Abstract
A bonded semiconductor structure includes a support substrate which carries a first electronic circuit, and an interconnect region carried by the support substrate. The interconnect region includes a capacitor and conductive line in communication with the first electronic circuit. The circuit includes a bonding layer carried by the interconnect region, and a bonded substrate coupled to the interconnect region through the bonding layer.
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Citations
24 Claims
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1. A bonded semiconductor structure, comprising:
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a support substrate which carries a first electronic circuit; an interconnect region carried by the support substrate, the interconnect region including a capacitor and conductive line in communication with the first electronic circuit; a bonding layer carried by the interconnect region; and a bonded substrate coupled to the interconnect region through the bonding layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A bonded semiconductor structure, comprising:
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an interconnect region which includes a capacitor and conductive line; a bonding layer carried by the interconnect region; and a bonded substrate coupled to the interconnect region through the bonding layer; wherein the interconnect region includes a first dielectric material region between the bonding layer and capacitor. - View Dependent Claims (14, 15, 16, 17, 18)
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19. A method of forming a bonded semiconductor structure, comprising:
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providing a support substrate which carries a first electronic circuit; providing an interconnect region carried by the support substrate, the interconnect region including a capacitor and conductive line in communication with the first electronic circuit; providing a bonding layer carried by the interconnect region; and coupling a bonded substrate to the interconnect region through the bonding layer. - View Dependent Claims (20, 21, 22, 23, 24)
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Specification