Optical Semiconductor Device Having Pre-Molded Leadframe with Window and Method Therefor
First Claim
1. A method of making a semiconductor device, comprising:
- providing a semiconductor die having an optically active area;
providing a leadframe having a plurality of contact pads and a light transmitting material disposed between the contact pads;
attaching the semiconductor die to the leadframe so that the optically active area is aligned with the light transmitting material to provide a light transmission path to the optically active area; and
disposing an underfill material between the semiconductor die and leadframe, the light transmitting material including an elevated area to prevent the underfill material from blocking the light transmission path.
6 Assignments
0 Petitions
Accused Products
Abstract
A semiconductor device is made by providing a semiconductor die having an optically active area, providing a leadframe or pre-molded laminated substrate having a plurality of contact pads and a light transmitting material disposed between the contact pads, attaching the semiconductor die to the leadframe so that the optically active area is aligned with the light transmitting material to provide a light transmission path to the optically active area, and disposing an underfill material between the semiconductor die and leadframe. The light transmitting material includes an elevated area to prevent the underfill material from blocking the light transmission path. The elevated area includes a dam surrounding the light transmission path, an adhesive ring, or the light transmission path itself can be the elevated area. An adhesive ring can be disposed on the dam. A filler material can be disposed between the light transmitting material and contact pads.
92 Citations
25 Claims
-
1. A method of making a semiconductor device, comprising:
-
providing a semiconductor die having an optically active area; providing a leadframe having a plurality of contact pads and a light transmitting material disposed between the contact pads; attaching the semiconductor die to the leadframe so that the optically active area is aligned with the light transmitting material to provide a light transmission path to the optically active area; and disposing an underfill material between the semiconductor die and leadframe, the light transmitting material including an elevated area to prevent the underfill material from blocking the light transmission path. - View Dependent Claims (2, 3, 4, 5, 6, 7)
-
-
8. A method of making a semiconductor device, comprising:
-
providing an optical semiconductor die; providing a leadframe having a plurality of contact pads and a light transmitting window disposed between the contact pads; and attaching the optical semiconductor die to the leadframe so that the light transmitting window is aligned to an optically active area of the optical semiconductor die. - View Dependent Claims (9, 10, 11, 12, 13)
-
-
14. A method of making a semiconductor package, comprising:
-
providing an optical semiconductor die; providing a substrate having a plurality of contact pads and a light transmitting material disposed between the contact pads; and attaching the optical semiconductor die to the substrate so that the light transmitting material is aligned to the optical semiconductor die. - View Dependent Claims (15, 16, 17, 18, 19)
-
-
20. A semiconductor package, comprising:
-
an optical semiconductor die; and a substrate having a plurality of contact pads and a light transmitting material disposed between the contact pads, wherein the optical semiconductor die is attached to the substrate so that the light transmitting material is aligned to an optically active area of the optical semiconductor die. - View Dependent Claims (21, 22, 23, 24, 25)
-
Specification