ENAMEL SUBSTRATE FOR MOUNTING LIGHT EMITTING ELEMENTS, LIGHT EMITTING ELEMENT MODULE, ILLUMINATION APPARATUS, DISPLAY APPARATUS, AND TRAFFIC SIGNAL

• US 20090225544A1
• Filed: 06/02/2006
• Published: 09/10/2009
• Est. Priority Date: 06/07/2005
• Status: Active Grant

• Current Assignee: Fujikura Limited
• Original Assignee: Fujikura Limited
• Inventors: Suzuki, Ryuji, Takemoto, Kyosuke
• Granted Patent: US 7,997,760 B2
• Time in Patent Office: Days
• US Class Current: 362/249.10
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 29/505 of reflectors
• CPC Class Codes: F21V 29/763 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 29/83 the elements having apertures, ducts or channels, e.g. heat radiation holes
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H05K 1/0204 using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 1/021 Components thermally connected to metal substrates or heat-sinks by insert mounting
• CPC Class Codes: H05K 1/053 the metal substrate being covered by an inorganic insulating layer
• CPC Class Codes: H05K 1/183 Components mounted in and supported by recessed areas of the printed circuit board
• CPC Class Codes: H05K 2201/09054 Raised area or protrusion of metal substrate
• CPC Class Codes: H05K 2201/09554 Via connected to metal substrate
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2203/135 : Electrophoretic deposition of insulating material
• CPC Class Codes: H05K 3/0061 : onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20

Abstract

An enamel substrate for mounting light emitting elements includes a core metal, an enamel layer that is covering on a surface of the core metal, and one or more through holes. In this enamel substrate for mounting light emitting elements, the core metal is exposed at inner surfaces of the through holes.

Claims

1. An enamel substrate for mounting light emitting elements comprising:

a core metal;

an enamel layer that is covering on a surface of the core metal; and

one or more through holes,

wherein the core metal is exposed at inner surfaces of the through holes.

2. The enamel substrate for mounting light emitting elements according to claim 1, further comprising:

a heat dissipation structure that has protruding portions, the protruding portions being inserted into the heat dissipation through holes.

3. The enamel substrate for mounting light emitting elements according to claim 2, wherein an adhesive agent having a high level of thermal conductivity is provided in a connecting portion between the enamel substrate for mounting light emitting elements and the heat dissipation structure.

4. A light emitting element module, comprising:

light emitting elements mounted on the enamel substrate for mounting light emitting elements according to claim 1.

5. An illumination apparatus comprising the light emitting element module according to claim 4.

6. A display apparatus comprising the light emitting element module according to claim 4.

7. A traffic signal comprising the light emitting element module according to claim 4.