SUB-ASSEMBLY AND METHODS FOR FORMING THE SAME

• US 20090225565A1
• Filed: 03/05/2009
• Published: 09/10/2009
• Est. Priority Date: 03/05/2008
• Status: Active Grant

• Current Assignee: Oree Advanced Illumination Solutions Ltd.
• Original Assignee: Oree, Advanced Illumination Solutions Inc.
• Inventors: Zimmermann, Micha, Meir, Noam
• Granted Patent: US 8,231,237 B2
• Time in Patent Office: Days
• US Class Current: 362/555
• CPC Class Codes: G02B 6/0021 for housing at least a part of the light source, e.g. by forming holes or recesses
• CPC Class Codes: G02B 6/0083 Details of electrical connections of light sources to drivers, circuit boards, or the like
• CPC Class Codes: G02B 6/0085 Means for removing heat created by the light source from the package heat extraction or cooling elements for semiconductor light sources in general H01L33/64
• CPC Class Codes: G02B 6/0091 of the light source relative to the light guide G02B6/0021 takes precedence
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

A sub-assembly matable to a waveguide having a recess therein includes a structure comprising a discrete light source disposed on a carrier, and a substrate and a heat spreader disposed beneath the structure. The structure has a contour complementary to the recess, such that, when the sub-assembly is joined to the waveguide, the discrete light source is within the waveguide.

Claims

1. A sub-assembly matable to a waveguide having a recess therein, the sub-assembly comprising:

a structure comprising a discrete light source disposed on a carrier, the structure having a contour complementary to the recess such that, when the sub-assembly is joined to the waveguide, the discrete light source is within the waveguide; and

disposed beneath the structure, a substrate and a heat spreader.

2. The sub-assembly of claim 1, wherein the structure fits snugly within the recess.

3. The sub-assembly of claim 1, wherein the discrete light source comprises a bare-die light-emitting diode.

4. The sub-assembly of claim 1, wherein a dimension of a top surface of the carrier is at least three times a dimension of the discrete light source.

5. The sub-assembly of claim 4, wherein the top surface of the carrier has an area at least three times an area of the discrete light source.

6. The sub-assembly of claim 1, wherein a top surface of the carrier is reflective.

7. The sub-assembly of claim 6, wherein the top surface of the carrier comprises an inner diffusive region surrounding the discrete light source, and a specular region surrounding the inner diffusive region.

8. The sub-assembly of claim 6, wherein the top surface of the carrier comprises an inner specular region surrounding the discrete light source, a diffusive region surrounding the inner specular region, and an outer specular region surrounding the diffusive region.

9. The sub-assembly of claim 1, further comprising a reflector disposed over the substrate.

10. The sub-assembly of claim 1, wherein the discrete light source is disposed in a recess in the carrier.

11. The sub-assembly of claim 10, wherein a top surface of the discrete light source is substantially coplanar with a top surface of the carrier.

12. The sub-assembly of claim 1, wherein a top surface of the carrier comprises a step complementary to a bottom surface of the discrete light source.

13. The sub-assembly of claim 1, wherein the structure comprises a cap disposed over the discrete light source, a shape of the cap at least partially defining the contour of the structure complementary to the recess.

14. The sub-assembly of claim 1, wherein a shape of the carrier defines the contour of the structure complementary to the recess.

15. The sub-assembly of claim 1, wherein the discrete light source is electrically connected to the carrier.

16. The sub-assembly of claim 15, wherein a contact on the discrete light source is in direct contact with a contact on the carrier.

17. The sub-assembly of claim 15, wherein the discrete light source is electrically connected to the carrier by at least one wire.

18. The sub-assembly of claim 1, wherein the discrete light source is electrically connected to the substrate by at least one wire.

19. The sub-assembly of claim 1, wherein a contact on the carrier is in direct contact with a contact on the substrate.

20. The sub-assembly of claim 1, wherein the substrate comprises an electrical connector for connection to an external power source.

21. The sub-assembly of claim 1, wherein the carrier comprises an electrical connector for connection to an external power source.

22. A sub-assembly comprising:

a discrete light source, wherein substantially all of the light emitted therefrom is emitted from a top surface; and

a reflective carrier disposed beneath and in direct contact with the discrete light source, a top surface of the reflective carrier comprising an inner diffusive region surrounding the discrete light source and a specular region surrounding the inner diffusive region.

23. A sub-assembly comprising:

a discrete light source, wherein substantially all of the light emitted therefrom is emitted from a top surface and at least one side surface; and

a reflective carrier disposed beneath and in direct contact with the discrete light source, a top surface of the reflective carrier comprising an inner specular region surrounding the discrete light source, a diffusive region surrounding the inner specular region, and an outer specular region surrounding the diffusive region.

24. A method of forming a sub-assembly matable to a waveguide having a recess therein, the method comprising:

providing a structure comprising a discrete light source disposed on a carrier, the structure having a contour complementary to the recess such that, when the structure is mated to the waveguide, the discrete light source is within the waveguide; and

disposing the structure over a substrate and a heat spreader.

25. The method of claim 24, wherein providing the structure comprises providing a cap over the discrete light source, a shape of the cap at least partially defining the contour of the structure complementary to the recess.

26. The method of claim 24, wherein a shape of the carrier at least partially defines the contour of the structure complementary to the recess.