Method and Apparatus for Packaging Circuit Devices
First Claim
Patent Images
1. A method comprising:
- providing a wafer comprising;
a first side;
a second side;
a plurality of sections disposed on the first side; and
a plurality of first annular surface portions disposed on a respective one of the plurality of sections;
forming a plurality of spaced structures on the first side of the wafer in a manner so that each of the structures is on a respective one of the sections, and so that each of the first annular surface portions extends around a respective one of the spaced structures;
providing a cover, the cover having on one side thereof a plurality of second annular surface portions which are each engageable with a respective one of the first annular surface portions;
bonding each of the first annular surface portions to a respective one of the second annular surface portions to create a plurality of hermetically sealed chambers between the wafer and the cover, each hermetically sealed chamber having therein a respective one of the structures;
creating an opening through the wafer that extends from the first side to the second side; and
forming a via within the opening, the via operable to provide a hermetic seal within the opening with respect to the first and second sides of the wafer, the via comprising;
a first end adjacent to the first side of the wafer;
a second end adjacent to the second side of the wafer;
a conductive portion operable to provide electrical conductivity between the first end and the second end;
forming a sleevelike portion with an electrically conductive material within the via; and
forming an electrically non-conductive core portion within the sleevelike portion.
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Abstract
A hermetically sealed package includes a lid (14) hermetically bonded to a wafer or substrate (12), with a chamber therebetween defined by a recess (16) in the lid. A circuit device (26) such as MEMS device is provided within the chamber on the substrate. A plurality of vias (41-46) are provided through the substrate, and each have a structure which facilitates a hermetic seal of a suitable level between opposite sides of the substrate. The vias provide electrical communication from externally of the assembly to the device disposed in the chamber.
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Citations
20 Claims
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1. A method comprising:
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providing a wafer comprising; a first side; a second side; a plurality of sections disposed on the first side; and a plurality of first annular surface portions disposed on a respective one of the plurality of sections; forming a plurality of spaced structures on the first side of the wafer in a manner so that each of the structures is on a respective one of the sections, and so that each of the first annular surface portions extends around a respective one of the spaced structures; providing a cover, the cover having on one side thereof a plurality of second annular surface portions which are each engageable with a respective one of the first annular surface portions; bonding each of the first annular surface portions to a respective one of the second annular surface portions to create a plurality of hermetically sealed chambers between the wafer and the cover, each hermetically sealed chamber having therein a respective one of the structures; creating an opening through the wafer that extends from the first side to the second side; and forming a via within the opening, the via operable to provide a hermetic seal within the opening with respect to the first and second sides of the wafer, the via comprising; a first end adjacent to the first side of the wafer; a second end adjacent to the second side of the wafer; a conductive portion operable to provide electrical conductivity between the first end and the second end; forming a sleevelike portion with an electrically conductive material within the via; and forming an electrically non-conductive core portion within the sleevelike portion. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method comprising:
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providing a wafer comprising a first side and a second side; forming an opening through the wafer, the opening extending from the first side to the second side; oxidizing the wafer; forming a via in the opening, the forming comprising; sputtering a first metal material onto the first and second sides and into the opening so as to completely cover surfaces within the opening; sputtering a second metal material onto the first and second sides into the opening so as to completely cover the first metal material within the opening; forming a glass material within the opening after the sputtering of the second metal material, the glass material forming a hermetic seal between the first and second sides of the wafer; forming a first annular flange around the opening on the first side of the wafer, and a second annular flange around the opening on the second side of the wafer, the annular flanges comprising the first and second metal materials; forming a micro-electro-mechanical system (MEMS) on the first side of the wafer; forming a lid by creating a recess in a sheet of glass material; and anodically bonding the lid to the first side of the wafer in order to form a hermetic seal between the lid and wafer, the lid being aligned so that the MEMS and the via is disposed within the recess of the lid; wherein the bonding the lid to the wafer occurs in an atmosphere of an inert gas so that the MEMS is hermetically sealed under the lid in the inert gas. - View Dependent Claims (11, 12, 13, 14, 15, 16)
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17. A method of forming a via comprising:
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forming an opening through a wafer; oxidizing the wafer; sputtering a first metal material onto the first and second sides and into the opening so as to completely cover surfaces within the opening; sputtering a second metal material onto the first and second sides into the opening so as to completely cover the first metal material within the opening; forming a glass material within the opening after the sputtering of the second metal material, the glass material forming a hermetic seal between the first and second sides of the wafer; and forming a first annular flange around the opening on the first side of the wafer, and a second annular flange around the opening on the second side of the wafer, the annular flanges comprising the first and second metal materials. - View Dependent Claims (18, 19, 20)
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Specification