MOUNTING STRUCTURE FOR SURFACE MOUNTED DEVICE AND METHOD OF FIRMLY MOUNTING SURFACE MOUNTED DEVICE

• US 20090227136A1
• Filed: 03/10/2009
• Published: 09/10/2009
• Est. Priority Date: 03/10/2008
• Status: Abandoned Application

• Current Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Inventors: TOKII, Seiji
• Application Number:
  US12/401,297
• Publication Number:
  US 20090227136A1
• Time in Patent Office: Days
• US Class Current: 439/345
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H05K 2201/10371 Shields or metal cases
• CPC Class Codes: H05K 2201/10393 Clamping a component by an element or a set of elements
• CPC Class Codes: H05K 2201/10734 Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 3/301 by means of a mounting structure H05K3/325 takes precedence
• CPC Class Codes: Y10T 29/49144 by metal fusion

Abstract

The present invention provides a mounting structure for a surface mounted device capable of reducing sufficiently the stress applied to external joint terminal portions of a surface mounted device due to an impact caused by, for example, dropping a mobile device such as a mobile phone. A mounting structure for a surface mounted device includes: a printed circuit board; a BGA package as a surface mounted device mounted on the printed circuit board; a reinforcing member attached to the printed circuit board astride the BGA package for covering the BGA package; and a pressure pin as a pressure member passing through a top plate of the reinforcing member, being in contact with the top surface of the BGA package, and being fixed to the reinforcing member with solder.

Claims

1. A mounting structure for a surface mounted device, comprising:

a surface mounted device mounted on a printed circuit board;

a reinforcing member attached onto the printed circuit board and including a top plate covering at least a periphery of a top surface of the surface mounted device; and

a pressure member passing through the top plate of the reinforcing member, being in contact with the top surface of the surface mounted device, and being fixed onto the top plate with a fixing member.

2. The mounting structure for a surface mounted device according to claim 1, wherein the pressure member is at least one of a pressure pin and a pressure bar.

3. The mounting structure for a surface mounted device according to claim 2, wherein a portion of the pressure member in contact with the top surface of the surface mounted device is positioned above a solder joint of a terminal of the surface mounted device and an electrode of the printed circuit board.

4. The mounting structure for a surface mounted device according to claim 2, wherein the number of the pressure pin that the mounting structure includes is four and the four pressure pins are in contact with four corner portions of the top surface of the surface mounted device.

5. The mounting structure for a surface mounted device according to claim 2, wherein the pressure bar includes:

a bar that comes into contact with the top surface of the surface mounted device; and

a support pin that is coupled to the bar and passes through the top plate of the reinforcing member.

6. The mounting structure for a surface mounted device according to claim 5, wherein the number of the pressure bar that the mounting structure includes is four, and the bars of the four pressure bars are disposed respectively along four sides of the top surface of the surface mounted device.

7. The mounting structure for a surface mounted device according to claim 1, wherein the reinforcing member is fixed to lands disposed around the surface mounted device.

8. The mounting structure for a surface mounted device according to claim 1, wherein a part of the reinforcing member is inserted into a positioning hole provided on the printed circuit board.

9. The mounting structure for a surface mounted device according to claim 1, wherein the surface mounted device is a ball grid allay package.

10. A method of firmly mounting a surface mounted device, comprising:

covering a surface mounted device mounted on a printed circuit board with a reinforcing member including a pressure member passing through a top plate of the reinforcing member and being soldered onto the top plate; and

bringing the pressure member into contact with a top surface of the surface mounted device by melting the soldered portion using a heating reflow process to cause the pressure member to drop under its own weight.