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INDUCTIVELY COUPLED INTEGRATED CIRCUIT WITH MULTIPLE ACCESS PROTOCOL AND METHODS FOR USE THEREWITH

  • US 20090227205A1
  • Filed: 03/04/2008
  • Published: 09/10/2009
  • Est. Priority Date: 03/04/2008
  • Status: Abandoned Application
First Claim
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1. An integrated circuit comprising:

  • a plurality of integrated circuit dies having a corresponding plurality of circuits and a corresponding plurality of inductive interfaces; and

    a substrate coupled to support the plurality of integrated circuit dies, the substrate including a magnetic communication path aligned with the plurality of inductive interfaces, to magnetically communicate signals between the plurality of circuits via the plurality of inductive interfaces in accordance with a multi access protocol.

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