INDUCTIVELY COUPLED INTEGRATED CIRCUIT WITH MULTIPLE ACCESS PROTOCOL AND METHODS FOR USE THEREWITH
First Claim
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1. An integrated circuit comprising:
- a plurality of integrated circuit dies having a corresponding plurality of circuits and a corresponding plurality of inductive interfaces; and
a substrate coupled to support the plurality of integrated circuit dies, the substrate including a magnetic communication path aligned with the plurality of inductive interfaces, to magnetically communicate signals between the plurality of circuits via the plurality of inductive interfaces in accordance with a multi access protocol.
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Abstract
A circuit includes a plurality of integrated circuit dies having a corresponding plurality of circuits and a corresponding plurality of inductive interfaces. A substrate is coupled to support the plurality of integrated circuit dies, the substrate including a magnetic communication path aligned with the plurality of inductive interfaces, to magnetically communicate signals between the plurality of circuits via the plurality of inductive interfaces in accordance with a multi access protocol.
67 Citations
19 Claims
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1. An integrated circuit comprising:
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a plurality of integrated circuit dies having a corresponding plurality of circuits and a corresponding plurality of inductive interfaces; and a substrate coupled to support the plurality of integrated circuit dies, the substrate including a magnetic communication path aligned with the plurality of inductive interfaces, to magnetically communicate signals between the plurality of circuits via the plurality of inductive interfaces in accordance with a multi access protocol. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method comprising:
magnetically communicating signals between a plurality of integrated circuit dies in accordance with a multi access protocol. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19)
Specification