Microfluid Chip Cleaning

• US 20090230044A1
• Filed: 03/13/2008
• Published: 09/17/2009
• Est. Priority Date: 03/13/2008
• Status: Abandoned Application

• Current Assignee: Agilent Technologies, Inc.
• Original Assignee: Agilent Technologies, Inc.
• Inventors: Bek, Fritz
• Application Number:
  US12/048,032
• Publication Number:
  US 20090230044A1
• Time in Patent Office: Days
• US Class Current: 210/198.100
• CPC Class Codes: B01L 13/02 for receptacle or instruments
• CPC Class Codes: B01L 3/502707 characterised by the manufacture of the container or its components by shaping or joining plastic parts B29C59/00, B29C65/00; by laminating B32B37/00; manufacture of microstructural devices in general B81C
• CPC Class Codes: B08B 3/12 by sonic or ultrasonic vibrations washing or rinsing machines for crockery or tableware using sonic or ultrasonic waves A47L15/13; of natural teeth, of prostheses using ultrasonic techniques similar to those used for natural teeth A61C17/20; application of ultrasonic vibrations to chemical, physical or physico-chemical processes in general B01J19/10
• CPC Class Codes: B08B 9/00 Cleaning hollow articles by methods or apparatus specially adapted thereto B08B6/00 takes precedence

Abstract

A method of cleaning a microfluidic chip (101) comprising at least one microstructure (105, 106) containing a material (111), wherein the method comprises removing the material (111) from the at least one microstructure (105, 106) so as to at least partly empty the at least one microstructure (105, 106).

Claims

1. A method of cleaning a microfluidic chip comprising at least one microstructure containing a material, wherein the method comprises

removing the material from the at least one microstructure so as to at least partly empty the at least one microstructure,

wherein the removing comprises at least one of:

heating the microfluidic chip;

irradiating the microfluidic chip with at least one of ultrasonic waves, electromagnetic radiation, and radioactive radiation;

chemically oxidizing the material to be removed from the at least one microstructure.

2. The method of claim 1, wherein the heating of the microfluidic chip comprises at least one of:

heating to a temperature in a range between essentially 250°

C. and essentially 550°

C., or in a range between essentially 350°

C. and essentially 450°

C.;

heating the microfluidic chip for a time interval in a range between essentially 1 hour and essentially 12 hours, or in a range between essentially 4 hours and essentially 8 hours;

heating the microfluidic chip in one of the group consisting of an air comprising atmosphere, an oxygen-enriched atmosphere, and an atmosphere consisting essentially of oxygen.

3. The method of claim 1, wherein the irradiating of the microfluidic chip comprises at least one of:

irradiating the microfluidic chip with ultrasonic waves transmitted using at least one of the group consisting of an aqueous solution, an acid, and a lye;

irradiating the microfluidic chip with electromagnetic radiation of at least one of the group consisting of infrared radiation, visible light, ultraviolet radiation, and X-rays.

4. The method of claim 1, comprising at least one of:

tempering the microfluidic chip before the disassembling, wherein preferably the tempering comprises heating the microfluidic chip to a temperature in the range between essentially 70°

C. and essentially 150°

C.;

before the removing, demounting a sipper device coupled to at least one of the at least one microfluidic structure and adapted to convey fluid and/or gel to the at least one microfluidic structure, wherein preferably the demounting comprises cutting the sipper device out of the microfluidic chip, and after the removing, preferably remounting the sipper device to the at least one of the at least one microfluidic structure.

5. The method of claim 1, comprising

after the removing, reconditioning the microfluidic chip for a specified microfluidic chip application, wherein the reconditioning preferably comprises adjusting the at least one microfluidic structure for the microfluidic chip application, and the adjusting preferably comprises at least one of tempering the microfluidic chip and coating a surface of the at least one microfluidic structure.

6. The method of claim 1, comprising at least one of:

the removing comprises removing solid material from the at least one microstructure;

the removing comprises applying a pressure to the at least one microstructure;

the removing comprises applying an overpressure or a low pressure to the at least one microstructure;

before the removing, disassembling a carrier element from the microfluidic chip;

after the removing, reassembling a carrier element to the microfluidic chip.

7. An apparatus for cleaning a microfluidic chip comprising at least one microstructure containing a material, wherein the apparatus comprises

a removing unit adapted for removing the material from the at least one microstructure so as to at least partly empty the at least one microstructure,

wherein the removing comprises at least one of the following:

heating the microfluidic chip;

irradiating the microfluidic chip with at least one of ultrasonic waves, electromagnetic radiation, and radioactive radiation;

chemically oxidizing the material to be removed from the at least one microstructure.

8. A microfluidic chip, comprising

a substrate;

at least one microstructure formed on and/or in the substrate;

wherein the at least one microstructure is cleaned at least partly from remnant material removed from the at least one microstructure so as to at least partly empty the at least one microstructure,

wherein the removing of the remnant material is provided by at least one of the following;

heating the microfluidic chip;

irradiating the microfluidic chip with at least one of ultrasonic waves, electromagnetic radiation, and radioactive radiation;

chemically oxidizing the material to be removed from the at least one microstructure.

9. The microfluidic chip of claim 8, comprising at least one of:

the at least one microstructure comprises at least one channel for channeling fluid and/or gel;

the at least one microstructure comprises at least one channel for channeling fluid and/or gel and comprises at least one through hole in fluid communication with the at least one channel;

the substrate comprises at least one of the group consisting of glass, a semiconductor material, a plastics material, a ceramics material and a metallic material;

the microfluidic chip comprises a further substrate coupled to the substrate, wherein the further substrate comprises at least one microstructure, wherein at least one of the at least one microstructure of the further substrate is aligned to be in fluid communication with at least one of the at least one microstructure of the substrate;

the microfluidic chip is adapted to analyze at least one of the group consisting of a physical, a chemical and a biological parameter of at least one compound of a fluid;

the microfluidic chip is adapted as at least one of a sensor device, a device for chemical, biological and/or pharmaceutical analysis, a gel electrophoresis device, a capillary electrophoresis device, a liquid chromatography device, a gas chromatography device, an electronic measurement device, and a mass spectroscopy device;

the microfluidic chip comprises a sipper device coupled to at least one of the at least one microfluidic structure and adapted to convey fluid and/or gel to the at least one microfluidic structure;

the microfluidic chip comprises a carrier element to be coupled to the substrate;

the microfluidic chip comprises a carrier element to be coupled to the substrate, wherein the carrier element is to be coupled to the substrate in a detachable manner.

10. The microfluidic chip of claim 9, comprising at least one of:

the further substrate is coupled to the substrate using at least one of bonding, gluing, and clamping.

11. A fluid separation system for separating compounds of a fluid, the fluid separation system comprising

a fluid delivering unit for delivering the fluid;

a separation unit adapted for separating compounds of the fluid;

wherein the separation unit comprises a microfluidic chip of claim 8, wherein the fluid is insertable in the at least one microstructure.