SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

• US 20090230424A1
• Filed: 03/11/2009
• Published: 09/17/2009
• Est. Priority Date: 03/11/2008
• Status: Active Grant

• Current Assignee: ROHM Co., Ltd.
• Original Assignee: ROHM Co., Ltd.
• Inventors: Kobayakawa, Masahiko, Okazaki, Tomokazu
• Granted Patent: US 8,431,949 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting device includes a semiconductor light emitting element, a first lead including an element mount portion on which the semiconductor light emitting element is mounted, and a second lead electrically connected to the semiconductor light emitting element. The light emitting device further includes a resin package covering the semiconductor light emitting element and part of each of the first and the second leads. The resin package includes a lens portion facing the semiconductor light emitting element. The first lead includes a pair of standing portions spaced from each other with the element mount portion intervening between them and a pair of terminal portions extending from the standing portions in mutually opposite directions. Each of the standing portions projects from the resin package in a direction away from the lens portion.

Claims

1. A light emitting device comprising:

a semiconductor light emitting element;

a first lead including an element mount portion on which the semiconductor light emitting element is mounted;

a second lead electrically connected to the semiconductor light emitting element; and

a resin package covering the semiconductor light emitting element and part of each of the first and the second leads, the resin package including a lens portion facing the semiconductor light emitting element;

wherein the first lead includes a pair of standing portions and a pair of terminal portions, the standing portions being spaced from each other with the element mount portion intervening therebetween, the terminal portions extending from the standing portions in opposite directions, and wherein each of the standing portions projects from the resin package in a direction away from the lens portion.

2. The light emitting device according to claim 1, wherein the second lead includes a pad for bonding a wire, a pair of standing portions spaced from each other with the pad intervening therebetween and a pair of terminal portions extending from the standing portions in mutually opposite directions, and wherein each of the standing portions projects from the resin package in a direction away from the lens portion.

3. The light emitting device according to claim 2, wherein the standing portions of at least one of the first and the second leads is designed to increase a distance therebetween as proceeding away from the lens portion.

4. The light emitting device according to claim 2, wherein one of the terminal portions of the first and the second leads is different in width from the other three terminal portions.

5. A method for manufacturing a light emitting device, the method comprising:

preparing a lead frame including a pair of frame bases and a first and a second leads provided between the frame bases, the frame bases being spaced from each other in a first direction, the first and the second leads extending in the first direction and being spaced from each other in a second direction, each of the leads including a pad at a center;

bending the first and the second leads so that the respective pads of the first and the second leads are translated in a third direction that is perpendicular to both the first direction and the second direction;

mounting a semiconductor light emitting element on the pad of the first lead;

connecting the semiconductor light emitting element and the pad of the second lead via a wire; and

forming a resin package to cover part of the first lead, part of the second lead, and the semiconductor light emitting element.