ELEMENT WAFER AND METHOD FOR MANUFACTURING THE SAME
First Claim
1. A method for manufacturing an element wafer, comprising the steps of:
- preparing a semiconductor wafer;
stacking a plurality of films on the semiconductor wafer and concurrently processing each of the films to form an element in a central region of the plurality of films on the semiconductor wafer; and
forming a recessed portion and/or a plurality of openings in at least one of the plurality of films, the recessed portion and the openings being arranged outside the central region and surrounding the central region.
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Accused Products
Abstract
A recessed portion is provided in first and second insulating films, the first insulating film being stacked on a semiconductor wafer, the second insulating film being stacked on the first insulating film. The first and second insulating films are processed to form wiring in a formation region of the semiconductor wafer in which an acceleration sensor is to be formed. After a sacrificial film is stacked on the wiring and processed, a conductive film is stacked on the wiring and processed to form a plurality of thin film structures in the formation region. The recessed portion surrounds the formation region.
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Citations
15 Claims
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1. A method for manufacturing an element wafer, comprising the steps of:
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preparing a semiconductor wafer; stacking a plurality of films on the semiconductor wafer and concurrently processing each of the films to form an element in a central region of the plurality of films on the semiconductor wafer; and forming a recessed portion and/or a plurality of openings in at least one of the plurality of films, the recessed portion and the openings being arranged outside the central region and surrounding the central region. - View Dependent Claims (2, 3, 4, 5, 8)
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6. A method for manufacturing an element wafer, comprising the steps of:
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preparing a semiconductor wafer; stacking a plurality of films on the semiconductor wafer and concurrently processing each of the films to form a plurality of elements side by side in a predetermined region of the films stacked on the semiconductor wafer; and forming recessed portions in at least one of the films excluding the top film of the plurality of films to partition the elements from each other. - View Dependent Claims (7)
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9. An element wafer comprising:
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a semiconductor wafer; a film stacked on the semiconductor wafer; and an element provided on a central region of the film stacked on the semiconductor wafer;
whereina plurality of films including said film are stacked in the outer region of the semiconductor wafer, the outer region being located outside of the central region, and a recessed portion and/or a plurality of openings are provided in at least one of the films stacked in the outer region of the semiconductor wafer, the recessed portion and/or the plurality of openings being arranged outside the central region and surrounding the central region. - View Dependent Claims (10, 11, 12, 13)
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14. An element wafer comprising:
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a semiconductor wafer; an insulating film stacked on the semiconductor wafer; plural pieces of wiring provided on a central region of the insulating film stacked on the semiconductor wafer; and a plurality of thin film structures provided on and connected with the respective pieces of the wiring;
whereinrecessed portions are provided in the insulating film to partition the thin film structures from each other.
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15. An element wafer comprising:
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a semiconductor wafer; an insulating film stacked on the semiconductor wafer; plural pieces of wiring provided on a central region of the insulating film stacked on the semiconductor wafer; a sacrificial film stacked on the insulating film and the wiring and having a plurality of openings formed therein, the opening exposing the respective pieces of the wiring; and a plurality of thin film structures provided on the sacrificial film and connected with the respective pieces of the wiring through the openings;
whereinrecessed portions are provided in the sacrificial film to partition the thin film structures from each other.
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Specification