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DIRECT COOLED POWER ELECTRONICS SUBSTRATE

  • US 20090231812A1
  • Filed: 03/09/2009
  • Published: 09/17/2009
  • Est. Priority Date: 03/17/2008
  • Status: Active Grant
First Claim
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1. A power electronics module operable in conjunction with a cooling system, the power electronics module comprising:

  • a substrate having;

    a three-dimensional outer peripheral surface;

    a first end portion disposed at a first end of the substrate, the first end portion operable to attach and seal to a coolant input header or a coolant output header of the cooling system;

    a second end portion disposed at a second end of the substrate which is opposite the first end, the second end portion operable to attach and seal to a coolant input header or a coolant output header of the cooling system;

    a substrate interior disposed within the three-dimensional outer peripheral surface and between the first and second end portions;

    one or more coolant flow channels passing through the substrate interior for carrying liquid coolant from the cooling system;

    a plurality of planar facets disposed on the three-dimensional outer peripheral surface and between the first and second end portions of the substrate, wherein at least one of the planar facets is disposed in a nonparallel relationship with another of the planar facets;

    a metal layer disposed on one or more of the planar facets; and

    one or more power electronic devices attached to the metal layer.

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