DIRECT COOLED POWER ELECTRONICS SUBSTRATE
First Claim
1. A power electronics module operable in conjunction with a cooling system, the power electronics module comprising:
- a substrate having;
a three-dimensional outer peripheral surface;
a first end portion disposed at a first end of the substrate, the first end portion operable to attach and seal to a coolant input header or a coolant output header of the cooling system;
a second end portion disposed at a second end of the substrate which is opposite the first end, the second end portion operable to attach and seal to a coolant input header or a coolant output header of the cooling system;
a substrate interior disposed within the three-dimensional outer peripheral surface and between the first and second end portions;
one or more coolant flow channels passing through the substrate interior for carrying liquid coolant from the cooling system;
a plurality of planar facets disposed on the three-dimensional outer peripheral surface and between the first and second end portions of the substrate, wherein at least one of the planar facets is disposed in a nonparallel relationship with another of the planar facets;
a metal layer disposed on one or more of the planar facets; and
one or more power electronic devices attached to the metal layer.
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Accused Products
Abstract
The disclosure describes directly cooling a three-dimensional, direct metallization (DM) layer in a power electronics device. To enable sufficient cooling, coolant flow channels are formed within the ceramic substrate. The direct metallization layer (typically copper) may be bonded to the ceramic substrate, and semiconductor chips (such as IGBT and diodes) may be soldered or sintered onto the direct metallization layer to form a power electronics module. Multiple modules may be attached to cooling headers that provide in-flow and out-flow of coolant through the channels in the ceramic substrate. The modules and cooling header assembly are preferably sized to fit inside the core of a toroidal shaped capacitor.
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Citations
15 Claims
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1. A power electronics module operable in conjunction with a cooling system, the power electronics module comprising:
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a substrate having; a three-dimensional outer peripheral surface; a first end portion disposed at a first end of the substrate, the first end portion operable to attach and seal to a coolant input header or a coolant output header of the cooling system; a second end portion disposed at a second end of the substrate which is opposite the first end, the second end portion operable to attach and seal to a coolant input header or a coolant output header of the cooling system; a substrate interior disposed within the three-dimensional outer peripheral surface and between the first and second end portions; one or more coolant flow channels passing through the substrate interior for carrying liquid coolant from the cooling system; a plurality of planar facets disposed on the three-dimensional outer peripheral surface and between the first and second end portions of the substrate, wherein at least one of the planar facets is disposed in a nonparallel relationship with another of the planar facets; a metal layer disposed on one or more of the planar facets; and one or more power electronic devices attached to the metal layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A power electronics assembly comprising:
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a toroidal-shaped capacitor having an interior cavity; a first header of a cooling system disposed within the interior cavity of the toroidal-shaped capacitor; a second header of the cooling system disposed within the interior cavity of the toroidal-shaped capacitor; and a plurality of power electronics modules disposed within the interior cavity of the toroidal-shaped capacitor and between the first and second headers, each of the power electronics modules comprising; a substrate having; a three-dimensional outer peripheral surface; a first end portion disposed at a first end of the substrate, the first end portion operable to attach and seal to the first header of the cooling system; a second end portion disposed at a second end of the substrate which is opposite the first end, the second end portion operable to attach and seal to the second header of the cooling system; a substrate interior disposed within the three-dimensional outer peripheral surface and between the first and second end portions; one or more coolant flow channels passing through the substrate interior for carrying liquid coolant from the cooling system; a plurality of planar facets disposed on the three-dimensional outer peripheral surface and between the first and second end portions of the substrate, wherein at least one of the planar facets is disposed in a nonparallel relationship with another of the planar facets; a metal layer disposed on one or more of the planar facets; and one or more power electronic devices attached to the metal layer. - View Dependent Claims (14, 15)
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Specification