Method of forming a permanent carrier and spacer wafer for wafer level optics and associated structure
First Claim
Patent Images
1. A method of forming an imager structure, the method comprising:
- etching trenches in a carrier substrate;
filling the trenches at least partially with a dissolvable material;
bonding an imager wafer to the carrier substrate, the imager wafer comprising imager arrays, each imager array being associated with and aligned within a respective trench and being spaced from the carrier substrate; and
removing the dissolvable material.
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Abstract
A carrier wafer for wafer level fabrication of imager structures comprising a substrate with trenches corresponding to locations of imager arrays on an imager wafer. A method of fabricating such a carrier wafer and a method of fabricating an imager module employing such a carrier wafer are also provided.
29 Citations
25 Claims
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1. A method of forming an imager structure, the method comprising:
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etching trenches in a carrier substrate; filling the trenches at least partially with a dissolvable material; bonding an imager wafer to the carrier substrate, the imager wafer comprising imager arrays, each imager array being associated with and aligned within a respective trench and being spaced from the carrier substrate; and removing the dissolvable material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of forming an imager structure, the method comprising:
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etching trenches in a first wafer, the trenches forming perimeters around inner areas corresponding to imager arrays on an imager wafer; placing a dissolvable material in the trenches; applying a bonding material to outer areas of at least one of the first wafer and the imager wafer; aligning the first wafer and the imager wafer, such that the imager arrays are aligned within the perimeters of the trenches; bonding the first wafer and the imager wafer; processing a backside of the imager wafer; and removing the dissolvable material and portions of the first wafer within a periphery of the trenches. - View Dependent Claims (11, 12, 13, 14, 15)
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16. A carrier wafer comprising:
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a substrate having a thickness; a plurality of trenches etched to form perimeters around a plurality of areas on the substrate, the trenches corresponding to respective perimeters of imager arrays on an imager wafer, the trenches having a depth less than the thickness of the substrate; and a dissolvable material within the trenches. - View Dependent Claims (17, 18, 19)
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20. An intermediate structure for use in imager module fabrication, the intermediate structure comprising:
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a substrate having a thickness; and at least one trench etched in the substrate, the at least one trench encircling a volume of the substrate. - View Dependent Claims (21, 22, 23, 24, 25)
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Specification