Component Comprising a MEMS Microphone and Method for the Production of Said Component
First Claim
1. A component with MEMS microphone, the component comprising:
- a housing that has a cavity;
terminals arranged in the cavity;
a sound inlet opening;
SMT contacts on an outer side of the housing;
a MEMS chip with microphone function that is installed in the cavity of the housing and closing the sound inlet opening from the inside, the MEMS chip being connected by means of an electrically conductive connection to the terminals arranged in the cavity of the housing and being connected through the housing to the SMT contacts, the MEMS chip being in mechanically intimate contact with the housing with its surface lying opposite the electrically conductive connections;
wherein a back side volume for the microphone function of the MEMS chip is expanded from the cavity in the housing to sides of the MEMS chip.
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Accused Products
Abstract
A component with a housing for a MEMS microphone is proposed that has a cavity with terminals arranged in the cavity, a sound inlet opening, and SMT contacts on an outer side. The MEMS chip installed in this housing closes the sound inlet opening from the inside and is connected by means of electrically conductive connections to the terminals of the housing. Opposite the electrically conductive connections, the MEMS chip is in mechanically intimate contact with the housing. The dimensioning of the housing relative to the MEMS chip allows the cavity at the sides of the MEMS chip to be used as an acoustic rear volume.
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Citations
29 Claims
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1. A component with MEMS microphone, the component comprising:
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a housing that has a cavity; terminals arranged in the cavity; a sound inlet opening; SMT contacts on an outer side of the housing; a MEMS chip with microphone function that is installed in the cavity of the housing and closing the sound inlet opening from the inside, the MEMS chip being connected by means of an electrically conductive connection to the terminals arranged in the cavity of the housing and being connected through the housing to the SMT contacts, the MEMS chip being in mechanically intimate contact with the housing with its surface lying opposite the electrically conductive connections; wherein a back side volume for the microphone function of the MEMS chip is expanded from the cavity in the housing to sides of the MEMS chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method for producing an encapsulated microphone, the method comprising:
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preparing a bottom housing part and a cover that are shaped so that they form a cavity between themselves at joint surfaces connecting to each other, wherein the bottom housing part has SMT contacts mounted on outside and inner terminals that are connected to the SMT contacts by means of vias through the bottom housing part; locating a MEMS chip with microphone function in the cavity of the bottom housing part and electrically connecting the MEMS chip with the inner terminals; and mounting the cover on the bottom housing part and attaching the cover with the bottom housing part and a reverse side of the MEMS chip, so that the MEMS chip is enclosed in the cavity but does not completely fill it. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29)
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Specification