Package of MEMS device and method for fabricating the same
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Abstract
A package of a micro-electro-mechanical systems (MEMS) device includes a cap wafer, a plurality of bonding bumps formed over the cap wafer, a plurality of array bumps arrayed on an outer side of the bonding bumps, and an MEMS device wafer over which a plurality of first outer pads are formed corresponding to the array bumps, wherein the array bumps are bonded to the respective outer pads when the cap wafer and the MEMS device wafer are bonded together.
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Citations
29 Claims
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1-15. -15. (canceled)
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16. A method for fabricating a package of a micro-electro-mechanical systems (MEMS) device, the method comprising:
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preparing a MEMS device wafer where a first array mark is formed and a plurality of first outer pads are formed adjacent to the first array mark; preparing a cap wafer where a second array mark, a plurality of bonding bumps, array bumps, and inner interconnection lines are formed, the second array mark formed corresponding to the first array mark, the array bumps respectively coupled to the bonding bumps through inner interconnection lines and formed in a region corresponding to the first outer pads; bonding the MEMS device wafer and the cap wafer in a manner to make the first array mark and the second array mark correspond to each other to thereby bond the first outer pads and the array bumps together; separating the cap wafer based on the first array mark; and separating the MEMS device wafer based on the second array mark. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29)
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Specification