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Non-planar sputter targets having crystlallographic orientations promoting uniform deposition

  • US 20090235709A1
  • Filed: 05/29/2009
  • Published: 09/24/2009
  • Est. Priority Date: 09/13/2002
  • Status: Active Grant
First Claim
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1. In a method of making a generally pot shaped sputter target having a first sputtering region defining a planar end wall or dome and a second sputtering region defining a sidewall connected to and extending from said first sputtering region to form an open end of said sputter target, the method of forming different crystallographic orientations in said first and second sputtering regions, the method comprising:

  • a. providing a hydroforming press having a platen, a housing holding a fluid filled bladder, and a mandrel;

    b. providing a metallic blank having a given crystallographic orientation, said blank having a first area that, as a result of said forming, will define said first sputtering region of said target, said blank further having a second area that, as a result of said forming, will define said second sputtering region of said target;

    c. placing said metallic blank between said mandrel and said bladder;

    d. providing relative movement between said mandrel and said bladder to press said blank therebetween;

    e. continuing to press said blank and cold working said blank in said second area of said blank thereby deforming said second area of said blank to about 35% or greater; and

    f. releasing said blank from between said mandrel and said bladder thereby yielding a sputter target wherein said second sputtering region of said target has a crystallographic orientation that is different from said given crystallographic orientation and from the crystallographic orientation of said first sputtering region.

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