ELECTRONIC DEVICE AND MANUFACTURING THEREOF
First Claim
Patent Images
1. A method, comprising:
- providing a carrier comprising a first conducting layer, a first insulating layer over the first conducting layer, and at least one through-connection from a first face of the first insulating layer to a second face of the first insulating layer;
attaching at least two semiconductor chips to the carrier;
applying a second insulating layer over the carrier;
opening the second insulating layer until the carrier is exposed;
depositing a metal layer over the opened second insulating layer; and
separating the at least two semiconductor chips after depositing the metal layer.
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Abstract
One aspect is a method including providing a carrier having a first conducting layer, a first insulating layer over the first conducting layer, and at least one through-connection from a first face of the first insulating layer to a second face of the first insulating layer; attaching at least two semiconductor chips to the carrier; applying a second insulating layer over the carrier; opening the second insulating layer until the carrier is exposed; depositing a metal layer over the opened second insulating layer; and separating the at least two semiconductor chips after depositing the metal layer.
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Citations
25 Claims
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1. A method, comprising:
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providing a carrier comprising a first conducting layer, a first insulating layer over the first conducting layer, and at least one through-connection from a first face of the first insulating layer to a second face of the first insulating layer; attaching at least two semiconductor chips to the carrier; applying a second insulating layer over the carrier; opening the second insulating layer until the carrier is exposed; depositing a metal layer over the opened second insulating layer; and separating the at least two semiconductor chips after depositing the metal layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A device, comprising:
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a carrier comprising a first conducting layer, a first insulating layer over the first conducting layer, and at least one first through-connection from a first face of the first insulating layer to a second face of the first insulating layer; a semiconductor chip attached to the carrier; a second insulating layer over the carrier and the semiconductor chip; a metal layer over the second insulating layer; a second through-connection through the second insulating layer electrically coupling the semiconductor chip to the metal layer; and a third through-connection through the second insulating layer electrically coupling the carrier to the metal layer. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18)
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19. A device, comprising:
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a carrier comprising a first insulating layer, a first contact pad attached to a first face of the first insulating layer, a second contact pad attached to a second face of the first insulating layer, and at least one first through-connection through the first insulating layer electrically coupling the first contact pad to the second contact pad, the shape of the first contact pad being different from the shape of the second contact pad; and a semiconductor chip over to the carrier; a second insulating layer over the carrier; a metal layer over the second insulating layer and the semiconductor chip, the metal layer being electrically coupled to the semiconductor chip; and a second through-connection through the second insulating layer electrically coupling the carrier to the metal layer. - View Dependent Claims (20, 21)
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22. A method, comprising:
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providing an insulating carrier; attaching a semiconductor chip to the carrier; applying an insulating layer over the carrier; opening the insulating layer until the carrier is exposed; depositing a metal layer over the opened insulating layer; and forming at least one through-connection in the carrier after attaching the semiconductor chip to the carrier. - View Dependent Claims (23, 24)
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25. A device, comprising:
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a carrier comprising a first conducting layer and a first insulating layer over the first conducting layer; means in the first insulating layer for electrically coupling from a first face of the first insulating layer to a second face of the first insulating layer; a semiconductor chip attached to the carrier; a second insulating layer over the carrier and the semiconductor chip; a metal layer over the second insulating layer; and means in the second insulating layer for electrically coupling the semiconductor chip to the metal layer.
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Specification