DETECTING TAMPERED WITH RADIO FREQUENCY IDENTIFICATION TAGS

• US 20090237249A1
• Filed: 03/20/2008
• Published: 09/24/2009
• Est. Priority Date: 03/20/2008
• Status: Active Grant

• Current Assignee: Neology Incorporated (OEP Technologie BV)
• Original Assignee: Sirit Technologies, Inc.
• Inventors: Bielas, Wolf
• Granted Patent: US 8,427,316 B2
• Time in Patent Office: Days
• US Class Current: 340/572.100
• CPC Class Codes: G06K 19/0739 the incapacitated circuit being part of an antenna
• CPC Class Codes: G06K 19/0776 the adhering arrangement being a layer of adhesive, so that the record carrier can function as a sticker
• CPC Class Codes: G06K 19/07798 part of the antenna or the integrated circuit being adapted for rupturing or breaking, e.g. record carriers functioning as sealing devices for detecting not-authenticated opening of containers electronic seals G09F3/03

Abstract

The present disclosure is directed to a system and method for tracking tampered with RFID tags. In some implementations, an RFID tag includes a tearable substrate including at least a portion of an RFID circuit. The portion of the RFID circuit is substantially destroyable in response to at least an attempt to remove the tag from a surface. In addition, the RFID includes an adhesive layer adjacent at least a portion of the tearable substrate and configured to affix the tag to the surface.

Claims

1. A Radio Frequency IDentification (RFID) tag, comprising:

a tearable substrate including at least a portion of an RFID circuit such that the portion of the RFID circuit is substantially destroyed in response to at least an attempt to remove the tag from a surface; and

an adhesive layer adjacent at least a portion of the tearable substrate and configured to affix the tag to the surface.

2. The RFID tag of claim 1, wherein the RFID circuit includes a metallic ink.

3. The method of claim 1, wherein the tearable material comprises a fiber material.

4. The RFID tag of claim 1, the adhesive layer comprising a first adhesive layer, the portion comprising a first portion, further comprising a facing material affix to a second portion of the tearable substrate using a second adhesive layer and configured to substantially cover the tag when affixed to the surface.

5. The RFID tag of claim 1, wherein the RFID circuit includes a tuning loop such that the tuning loop is substantially destroyed in response to at least an attempt to remove the tag.

6. The RFID tag of claim 1, wherein the RFID circuit is diffused into the tearable substrate.

7. The RFID tag of claim 1, wherein the RFID circuit is destroyed in response to at least shearing substantially parallel to a plane of the substrate.

8. The RFID tag of claim 1, wherein the RFID circuit is destroyed in response to at least shearing substantially perpendicular to a plane of the substrate.

9. The RFID tag of claim 1, further comprising a release liner affixed to at least a portion of a surface of the substrate using the adhesive layer.

10. The RFID tag of claim 1, wherein the RFID circuit is at least partially diffused into the substrate using one or more thermal processes.

11. The RFID tag of claim 1, further comprising a memory chip connected to the RFID circuit using thermal compression.

12. The RFID tag of claim 1, wherein the RFID circuit is passive.

13. The RFID tag of claim 1, wherein the tag is inoperable when the portion of the RFID circuit is destroyed.

14. The RFID tag of claim 1, wherein the portion of the RFID circuit is destroyed when the substrate is torn during an attempt to remove the tag.

15. A method of manufacturing a Break On Removal (BOR) tag, comprising:

printing a least a portion of an RFID circuit on a fiber material;

heating the fiber material for a period of time to diffuse at least a portion of the RFID into the fiber material;

affixing a memory chip to the RFID circuit; and

affixing a release liner adjacent a surface of the fiber material using an adhesive.

16. The method of claim 15, wherein the portion of the RFID circuit is printed using flexography.

17. The method of claim 15, wherein the RFID circuit is printed using conductive ink.

18. The method of claim 15, wherein the fiber material is paper.

19. The method of claim 15, wherein the fiber material is heated to 100°

C. or greater.

20. The method of claim 15, further comprising affixing a facing material adjacent the RFID circuit using an adhesive.