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SEMICONDUCTOR MEMORY DEVICES WITH INTERFACE CHIPS HAVING MEMORY CHIPS STACKED THEREON

  • US 20090237971A1
  • Filed: 02/06/2009
  • Published: 09/24/2009
  • Est. Priority Date: 03/19/2008
  • Status: Active Grant
First Claim
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1. A semiconductor memory device comprising:

  • first through mth substrates, wherein m is a natural number greater than 1; and

    first through nth stacked memories spaced apart and connected to each of the first through mth substrates, each of the first through nth stacked memories including an interface chip that is connected the respective substrate and further including a plurality of memory chips stacked on the interface chip, wherein n is a natural number,wherein a kth one of the interface chips transmits a signal to a k+1th interface chip connected to the same substrate, wherein k is a natural number that is equal to or greater than 1 and is less than or equal to n−

    1.

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