×

Pressure-Reinforced Fluidic Chip

  • US 20090238722A1
  • Filed: 03/18/2008
  • Published: 09/24/2009
  • Est. Priority Date: 03/18/2008
  • Status: Abandoned Application
First Claim
Patent Images

1. A fluidic chip device adapted for processing a fluidic sample, the fluidic chip device comprisinga substrate comprising a fluidic conduit for conducting the fluidic sample under pressure;

  • two reinforcing structures between which the substrate is arranged, wherein the two reinforcing structures are connected to one another to reinforce pressure resistance of the substrate.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×