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MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHODS FOR MANUFACTURING MICROELECTRONIC DEVICES

  • US 20090239337A1
  • Filed: 05/20/2009
  • Published: 09/24/2009
  • Est. Priority Date: 08/19/2005
  • Status: Active Grant
First Claim
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1. A method for manufacturing a microelectronic device, comprising:

  • attaching a microelectronic die to a first interposer substrate;

    coupling a second interposer substrate to the microelectronic die with the microelectronic die positioned between the first and second interposer substrates;

    electrically coupling the microelectronic die to the first interposer substrate; and

    wire-bonding the second interposer substrate to the first interposer substrate.

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