MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHODS FOR MANUFACTURING MICROELECTRONIC DEVICES
First Claim
1. A method for manufacturing a microelectronic device, comprising:
- attaching a microelectronic die to a first interposer substrate;
coupling a second interposer substrate to the microelectronic die with the microelectronic die positioned between the first and second interposer substrates;
electrically coupling the microelectronic die to the first interposer substrate; and
wire-bonding the second interposer substrate to the first interposer substrate.
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Accused Products
Abstract
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices are described herein. In one embodiment, a set of stacked microelectronic devices includes (a) a first microelectronic die having a first side and a second side opposite the first side, (b) a first substrate attached to the first side of the first microelectronic die and electrically coupled to the first microelectronic die, (c) a second substrate attached to the second side of the first microelectronic die, (d) a plurality of electrical couplers attached to the second substrate, (e) a third substrate coupled to the electrical couplers, and (f) a second microelectronic die attached to the third substrate. The electrical couplers are positioned such that at least some of the electrical couplers are inboard the first microelectronic die.
104 Citations
23 Claims
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1. A method for manufacturing a microelectronic device, comprising:
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attaching a microelectronic die to a first interposer substrate; coupling a second interposer substrate to the microelectronic die with the microelectronic die positioned between the first and second interposer substrates; electrically coupling the microelectronic die to the first interposer substrate; and wire-bonding the second interposer substrate to the first interposer substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method for stacking microelectronic devices, comprising:
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providing a first microelectronic device including a microelectronic die, a first interposer substrate coupled to the microelectronic die, and a second interposer substrate coupled to the microelectronic die such that the die is positioned between the first and second interposer substrates; providing a second microelectronic device including a microelectronic die and an interposer substrate coupled to the microelectronic die; and stacking the second microelectronic device on top of the first microelectronic device with a plurality of electrical couplers positioned between the first and second microelectronic devices and inboard the die of the first microelectronic device. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16)
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17. A method for manufacturing a plurality of microelectronic devices, comprising:
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mounting a plurality of microelectronic dies to a first interposer substrate with the dies arranged in an array; attaching a plurality of second interposer substrates to corresponding microelectronic dies with the microelectronic dies positioned between the first interposer substrate and the associated second interposer substrate; and electrically coupling the second interposer substrates to the first interposer substrate. - View Dependent Claims (18, 19, 20, 21, 22, 23)
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Specification