IMPLANTABLE ELECTRODE LEAD SYSTEM WITH A THREE DIMENSIONAL ARRANGEMENT AND METHOD OF MAKING THE SAME

• US 20090240314A1
• Filed: 03/24/2009
• Published: 09/24/2009
• Est. Priority Date: 03/24/2008
• Status: Abandoned Application

• Current Assignee: Neuronexus Technologies Incorporated (NEL Group, Inc.)
• Original Assignee: Neuronexus Technologies Incorporated (NEL Group, Inc.)
• Inventors: Wiler, James A., Kong, K. C., Pellinen, David S., Gulari, Mayurachat, Hetke, Jamille Farraye
• Application Number:
  US12/410,253
• Publication Number:
  US 20090240314A1
• Time in Patent Office: Days
• US Class Current: 607/116
• CPC Class Codes: A61B 2562/028 Microscale sensors, e.g. electromechanical sensors [MEMS]
• CPC Class Codes: A61B 2562/125 characterised by the manufacture of electrodes
• CPC Class Codes: A61B 5/24 Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
• CPC Class Codes: A61N 1/0529 Electrodes for brain stimulation
• CPC Class Codes: A61N 1/0534 Electrodes for deep brain stimulation
• CPC Class Codes: H05K 1/147 at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit H05K1/148 takes precedence

Abstract

One embodiment of the invention includes an implantable electrode lead system that includes a series of shims stacked upon each other, a series of first components, and a series of second components connected to the series of first components through a series of connectors. One of the first components extends from one of the shims, and another of the first components extends from another one of the shims. The shims position the first components in a three dimensional arrangement.

Claims

1. An implantable electrode lead system comprising:

a series of shims stacked upon each other;

a series of first components, wherein one first component extends from one of the shims and another first component extends from another one of the shims;

a series of second components; and

a series of connectors that connect the series of first components to the series of second components;

wherein the shims position the first components in a three dimensional arrangement.

2. The implantable electrode lead system of claim 1, wherein the shims are generally identical to each other.

3. The implantable electrode lead system of claim 1, wherein the ratio of shims to components in the implantable electrode lead system is approximately 1:

1.

4. The implantable electrode lead system of claim 1, wherein the shims are generally planar with a predetermined thickness, wherein the thickness determines a controlled and configurable spacing of the components of the implantable electrode lead system.

5. The implantable electrode lead system of claim 1, wherein the shims are made of a silicon substrate.

6. The implantable electrode lead system of claim 1, wherein the shims include an alignment feature to facilitate stacking of the shims.

7. The implantable electrode lead system of claim 6, wherein the shims define a hole as an alignment feature.

8. The implantable electrode lead system of claim 6, wherein the shims define a male and female mating elements.

9. The implantable electrode lead system of claim 1, wherein at least a portion of the shims define a component receptacle that receives at least one of the components.

10. The implantable electrode lead system of claim 9, wherein the component receptacle is a cross-shaped cavity that anchors the at least one component in at least two dimensions.

11. The implantable electrode lead system of claim 1, wherein the first components include neural interface electrode arrays that interface with tissue of a patient in a three-dimensional manner.

12. The implantable electrode lead system of claim 11, wherein the neural interface electrode arrays perform one or more of the following:

stimulation, recording, chemical sensing, and drug delivery.

13. The implantable electrode lead system of claim 12, wherein the neural interface electrode arrays are made of a thin-film polymer substrate.

14. The implantable electrode lead system of claim 1, wherein the second components control the first components via the connectors.

15. The implantable electrode lead system of claim 14, wherein the ratio of second components to first components is approximately 1:

1.

16. The implantable electrode lead system of claim 14, wherein the second components include flexible printed circuit boards with integrated circuits.

17. The implantable electrode lead system of claim 16, wherein the first components are made of a silicon material, and wherein the connectors are ribbon cables that are integrated with the components.

18. The implantable electrode lead system of claim 1, wherein the second components include an interconnection feature to facilitate mutual coupling of the second components.

19. The implantable electrode lead system of claim 1, further comprising a third component coupled to the series of second components, wherein the third component includes an input/output printed circuit board.

20. The implantable electrode lead system of claim 1, further comprising a cover that protects the shims.

21. The implantable electrode lead system of claim 1, further comprising an insertion bar that couples to the series of components and an insertion driver that moves the insertion bar and thereby moves the series of components into the tissues of a patient.