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Circuitized substrate and method of making same

  • US 20090241332A1
  • Filed: 03/28/2008
  • Published: 10/01/2009
  • Est. Priority Date: 03/28/2008
  • Status: Abandoned Application
First Claim
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1. A method of making a circuitized substrate comprising:

  • providing a first conductive circuit layer having first and second sides;

    bonding a first dielectric layer having a first thickness to said first side of said conductive circuit layer and a second dielectric layer having a second thickness to said second side of said conductive circuit layer;

    forming a first plurality of holes within said first and second dielectric layers, said first plurality of holes extending through said first and second dielectric layers;

    bonding third and fourth dielectric layers to said first and second dielectric layers, respectively, such that said first and third dielectric layers will have a combined third thickness and that said second and fourth dielectric layers will have a combined fourth thickness;

    forming a second plurality of holes within each of said first, second, third and fourth dielectric layers, each of said second plurality of holes being in alignment with a respective one of said first plurality of holes within said first and second dielectric layers to thereby form a plurality of continuous holes through said first, second, third and fourth dielectric layers; and

    positioning a quantity of conductive paste within each of said continuous holes to thereby form a plurality of continuous thru-holes each having a length such that said conductive paste within each of said thru-holes will possess a relatively low resistivity.

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