Circuitized substrate and method of making same
First Claim
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1. A method of making a circuitized substrate comprising:
- providing a first conductive circuit layer having first and second sides;
bonding a first dielectric layer having a first thickness to said first side of said conductive circuit layer and a second dielectric layer having a second thickness to said second side of said conductive circuit layer;
forming a first plurality of holes within said first and second dielectric layers, said first plurality of holes extending through said first and second dielectric layers;
bonding third and fourth dielectric layers to said first and second dielectric layers, respectively, such that said first and third dielectric layers will have a combined third thickness and that said second and fourth dielectric layers will have a combined fourth thickness;
forming a second plurality of holes within each of said first, second, third and fourth dielectric layers, each of said second plurality of holes being in alignment with a respective one of said first plurality of holes within said first and second dielectric layers to thereby form a plurality of continuous holes through said first, second, third and fourth dielectric layers; and
positioning a quantity of conductive paste within each of said continuous holes to thereby form a plurality of continuous thru-holes each having a length such that said conductive paste within each of said thru-holes will possess a relatively low resistivity.
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Abstract
A circuitized substrate and method of making same in which a first plurality of holes are formed within two bonded dielectric layers and then made conductive, e.g., plated. The substrate also includes third and fourth dielectric layers bonded to the first and second with a plurality of continuous electrically conductive thru holes extending through all four dielectric layers. Conductive paste is positioned within the thru holes for providing electrical connections between desired conductive layers of the substrate and outer layers as well. A circuitized substrate assembly and method of making same are also provided.
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Citations
20 Claims
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1. A method of making a circuitized substrate comprising:
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providing a first conductive circuit layer having first and second sides; bonding a first dielectric layer having a first thickness to said first side of said conductive circuit layer and a second dielectric layer having a second thickness to said second side of said conductive circuit layer; forming a first plurality of holes within said first and second dielectric layers, said first plurality of holes extending through said first and second dielectric layers; bonding third and fourth dielectric layers to said first and second dielectric layers, respectively, such that said first and third dielectric layers will have a combined third thickness and that said second and fourth dielectric layers will have a combined fourth thickness; forming a second plurality of holes within each of said first, second, third and fourth dielectric layers, each of said second plurality of holes being in alignment with a respective one of said first plurality of holes within said first and second dielectric layers to thereby form a plurality of continuous holes through said first, second, third and fourth dielectric layers; and positioning a quantity of conductive paste within each of said continuous holes to thereby form a plurality of continuous thru-holes each having a length such that said conductive paste within each of said thru-holes will possess a relatively low resistivity. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A circuitized substrate comprising:
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a first dielectric layer having a first thickness; a conductive circuit positioned on said first dielectric layer; a second dielectric layer having a second thickness bonded to said conductive circuit; a first plurality of holes extending through said first and second dielectric layers and including an electrically conductive layer thereon; third and fourth dielectric layers bonded to said first and second dielectric layers, respectively; a plurality of continuous thru holes extending through said first, second third and fourth dielectric layers, each of said plurality of continuous thru holes being in alignment with a respective one of said first plurality of holes within said first and second dielectric layers and including a quantity of electrically conductive paste therein, said electrically conductive paste possessing a relatively low resistivity. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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Specification