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PHOTONIC MILLING USING DYNAMIC BEAM ARRAYS

  • US 20090242522A1
  • Filed: 09/22/2008
  • Published: 10/01/2009
  • Est. Priority Date: 03/31/2008
  • Status: Active Grant
First Claim
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1. A laser processing system comprising:

  • a beam positioning system to align beam delivery coordinates relative to a workpiece, the beam positioning system generating position data corresponding to the alignment;

    a pulsed laser source;

    a beamlet generation module to receive a laser pulse from the pulsed laser source, and to generate from the laser pulse a beamlet array comprising a plurality of beamlet pulses;

    a beamlet modulator to modulate the amplitude of each beamlet pulse in the beamlet array; and

    beamlet delivery optics to focus the modulated beamlet array onto one or more targets at locations on the workpiece corresponding to the position data.

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