COMBINED SERIAL/PARALLEL LIGHT CONFIGURATION

• US 20090243501A1
• Filed: 09/22/2008
• Published: 10/01/2009
• Est. Priority Date: 03/26/2008
• Status: Abandoned Application

• Current Assignee: Manufacturing Resources International, Inc.
• Original Assignee: Manufacturing Resources International, Inc.
• Inventors: Williams, David, DUNN, William
• Application Number:
  US12/235,232
• Publication Number:
  US 20090243501A1
• Time in Patent Office: Days
• US Class Current: 315/192
• CPC Class Codes: H05B 45/40 Details of LED load circuits
• CPC Class Codes: Y02B 20/30 Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Abstract

Exemplary embodiments connect lights in both series and parallel. The lights can be LEDs, organic light emitting diodes (OLED), field emitting display (FED), light emitting polymer (LEP), or organic electro-luminescence (OEL). Exemplary embodiments also mount the lights on a printed circuit board (PCB) which has low thermal resistivity between the surface containing the lights and the opposite surface. The opposite surface may be metallic, and air may be forced over this surface in order to cool the assembly.

Claims

1. An illumination circuit comprising:

a power source;

a first group of lights comprising two or more lights connected in parallel;

a positive conduction line connected to said power source and to said first group of lights;

a second group of lights comprising two or more lights connected in parallel, wherein said second group of lights is connected in series to said first group of lights; and

a negative conduction line connected to said second group of lights and returning to said power source.

2. The illumination circuit from claim 1 further comprising:

a third group of lights comprising two or more lights connected in parallel; and

wherein said third group of lights is connected in series to said second group of lights and to said negative conduction line returning to said power source.

3. The illumination circuit from claim 2 wherein said lights are LEDs.

4. The illumination circuit from claim 2 wherein said lights are any one of the following:

organic light emitting diodes (OLED), field emitting display (FED), light emitting polymer (LEP), and organic electro-luminescence (OEL).

5. The illumination circuit from claim 1 wherein said lights and conduction lines are attached to a printed circuit board (PCB).

6. The illumination circuit from claim 5 wherein said PCB is a metal core PCB.

7. The illumination circuit from claim 6 wherein the rear surface of the metal core PCB is metallic.

8. An illumination assembly comprising:

a metal core printed circuit board (PCB) comprising front and rear surfaces;

a first group of lights mounted on the front surface of said PCB, said first group of lights comprising two or more lights connected in parallel;

a second group of lights mounted on said front surface of said PCB, said second group of lights comprising two or more lights connected in parallel, wherein said second group of lights is connected in series to said first group of lights;

a power source;

a positive conduction line connected to said power source and to said first group of lights; and

a negative conduction line connected to said second group of lights and returning to said power source.

9. The illumination assembly from claim 8 wherein said lights are LEDs.

10. The illumination assembly from claim 8 wherein said lights are any one of the following:

organic light emitting diodes (OLED), field emitting display (FED), light emitting polymer (LEP), and organic electro-luminescence (OEL).

11. The illumination assembly from claim 8 further comprising:

a third group of lights mounted on said front surface of said PCB, said third group of lights comprising two or more lights connected in parallel, wherein said third group of lights is connected in series to said second group of lights and to said negative conduction line returning to said power source.

12. The illumination assembly from claim 11 wherein said PCB has a low thermal resistivity between the front and rear surfaces.

13. The illumination assembly from claim 12 wherein air is forced over the rear surface of the PCB.

14. The illumination assembly from claim 13 wherein the rear surface of the PCB is metallic.

15. An illumination assembly comprising:

a metal core printed circuit board (PCB) comprising front and rear surfaces, wherein said rear surface is metallic and said front surface is highly reflective;

a first group of LEDs mounted on the front surface of said PCB, said first group of LEDs comprising two or more LEDs connected in parallel;

a second group of LEDs mounted on said front surface of said PCB, said second group of LEDs comprising two or more LEDs connected in parallel, wherein said second group of LEDs is connected in series to said first group of LEDs;

a power source;

a positive conduction line connected to said power source and to said first group of LEDs; and

a negative conduction line connected to said second group of LEDs and returning to said power source.

16. The illumination assembly from claim 15 further comprising:

a third group of LEDs mounted on said front surface of said PCB, said third group of LEDs comprising two or more LEDs connected in parallel, wherein said third group of LEDs is connected in series to said second group of LEDs and also to said negative conduction line returning to said power source.

17. The illumination assembly from claim 16 wherein said rear surface of said PCB is aluminum.

18. The illumination assembly from claim 16 wherein air is forced over the rear surface of said PCB.

19. The illumination assembly from claim 16 wherein said front surface of said PCB is white.

20. The illumination assembly from claim 16 wherein said connections are comprised of copper.