METHOD AND SYSTEM FOR PROCESSING SIGNALS VIA AN OSCILLATOR LOAD EMBEDDED IN AN INTEGRATED CIRCUIT (IC) PACKAGE

• US 20090243741A1
• Filed: 03/27/2008
• Published: 10/01/2009
• Est. Priority Date: 03/27/2008
• Status: Abandoned Application

• Current Assignee: Avago Technologies General IP PTE Limited (Broadcom, Inc.)
• Original Assignee: Avago Technologies General IP PTE Limited (Broadcom, Inc.)
• Inventors: Rofougaran, Ahmadreza
• Application Number:
  US12/056,505
• Publication Number:
  US 20090243741A1
• Time in Patent Office: Days
• US Class Current: 331/179
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H03B 2201/025 the means being an electronic switch for switching in or out oscillator elements
• CPC Class Codes: H03B 5/1212 the amplifier comprising a pair of transistors, wherein an output terminal of each being connected to an input terminal of the other, e.g. a cross coupled pair
• CPC Class Codes: H03B 5/1215 the current source or degeneration circuit being in common to both transistors of the pair, e.g. a cross-coupled long-tailed pair
• CPC Class Codes: H03B 5/1228 the amplifier comprising one or more field effect transistors
• CPC Class Codes: H03B 5/1243 the means comprising voltage variable capacitance diodes
• CPC Class Codes: H03B 5/1265 switched capacitors
• CPC Class Codes: H03J 2200/10 Tuning of a resonator by means of digitally controlled capacitor bank

Abstract

Aspects of a method and system for processing signals via an oscillator load embedded in an IC package are provided. In this regard, a hybrid circuit may comprise an oscillator, and a frequency of the oscillator may be controlled via a digital control word. Furthermore, the hybrid circuit may comprise an integrated circuit bonded to a multi-layer package and at least a portion of the oscillator may be within and/or on the multi-layer package. The at least a portion of the oscillator may be fabricated in one or more metal layers of the multi-layer package. The at least a portion of the oscillator in the multi-layer package may be fabricated utilizing microstrip and/or stripline transmission line. A frequency of the oscillator may be controlled via one or more inductors and/or capacitors in the portion of the oscillator in the multi-layer package.

Claims

1. A method for signal processing, the method comprising:

in a hybrid circuit comprising an integrated circuit bonded to a multi-layer package, controlling a frequency of an oscillator via a digital control word, wherein at least a portion of said oscillator is within and/or on said multi-layer package.

2. The method according to claim 1, wherein said at least a portion of said oscillator is fabricated in one or more metal layers of said multi-layer package.

3. The method according to claim 1, wherein said at least a portion of said oscillator is fabricated in microstrip transmission line.

4. The method according to claim 1, wherein said at least a portion of said oscillator is fabricated in stripline transmission line.

5. The method according to claim 1, comprising controlling a frequency of said oscillator via an inductance of one or more inductors in said at least a portion of said oscillator

6. The method according to claim 1, comprising controlling a frequency of said oscillator via a capacitance of one or more capacitors in said at least a portion of said oscillator.

7. The method according to claim 1, comprising controlling a capacitance in said oscillator via a portion of said digital control word.

8. The method according to claim 7, wherein said capacitance comprises a bank of capacitors communicatively coupled via one or more switching elements.

9. The method according to claim 1, comprising controlling a capacitance in said oscillator via an analog representation of a portion of said digital control word.

10. The method according to claim 9, wherein said capacitance comprises a voltage controlled capacitor.

11. The method according to claim 1, wherein said integrated circuit is flip-chip bonded to said multi-layer package.

12. A system for signal processing, the system comprising:

one or more circuits in a hybrid circuit, said hybrid circuit comprising an integrated circuit bonded to a multi-layer package and said one or more circuits comprising an oscillator, wherein said one or more circuits enable control of a frequency of said oscillator via a digital control word, wherein at least a portion of said oscillator is within and/or on said multi-layer package.

13. The system according to claim 12, wherein said at least a portion of said oscillator is fabricated in one or more metal layers of said multi-layer package.

14. The system according to claim 12, wherein said at least a portion of said oscillator is fabricated in microstrip transmission line.

15. The system according to claim 12, wherein said at least a portion of said oscillator is fabricated in stripline transmission line.

16. The system according to claim 12, wherein said at least a portion of said oscillator comprises one or more inductors that, at least in part, determine a frequency of said oscillator.

17. The system according to claim 12, wherein said at least a portion of said oscillator comprises one or more capacitors that, at least in part, determine a frequency of said oscillator.

18. The system according to claim 12, wherein said one or more circuits control a capacitance in said oscillator via a portion of said digital control word.

19. The system according to claim 18, wherein said capacitance comprises a bank of capacitors communicatively coupled via one or more switching elements.

20. The system according to claim 12, wherein said one or more circuits control a capacitance in said oscillator via an analog representation of a portion of said digital control word.

21. The system according to claim 20, wherein said capacitance comprises a voltage controlled capacitor.

22. The system according to claim 12, wherein said integrated circuit is flip-chip bonded to said multi-layer package.