METHOD AND SYSTEM FOR PROCESSING SIGNALS VIA POWER SPLITTERS EMBEDDED IN AN INTEGRATED CIRCUIT PACKAGE

• US 20090243753A1
• Filed: 03/28/2008
• Published: 10/01/2009
• Est. Priority Date: 03/28/2008
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Rofougaran, Ahmadreza
• Granted Patent: US 7,982,555 B2
• Time in Patent Office: Days
• US Class Current: 333/128
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/15192 Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/15321 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01P 5/16 Conjugate devices, i.e. devices having at least one port decoupled from one other port

Abstract

Methods and systems for processing signals via power splitters embedded in an integrated circuit package may include generating via a power splitter, one or more RF signals proportional to one or more received RF signals. The power splitter may be integrated in a multi-layer package. The generated RF signals may be processed via an integrated circuit, which may be electrically coupled to the multi-layer package. The power splitters may include quarter wavelength transmission lines. The transmission lines may include a microstrip structure or a coplanar structure. The power splitters may be bonded to one or more capacitors in the integrated circuit. The capacitors may include CMOS devices in the integrated circuit. The power splitters may include lumped devices which may include surface mount devices coupled to the multi-layer package or devices within the integrated circuit, which may be flip-chip bonded to the multi-layer package.

Claims

1. A method for wireless communication, the method comprising:

generating via a power splitter, one or more RF signals whose power is proportional to one or more received RF signals, wherein said power splitter is integrated in a multi-layer package; and

processing said one or more generated RF signals via one or more circuits within an integrated circuit, wherein said integrated circuit is bonded to said multi-layer package.

2. The method according to claim 1, wherein said power splitter comprises quarter wavelength transmission lines or any integer multiple of quarter wavelength.

3. The method according to claim 2, wherein said transmission lines comprise a microstrip structure.

4. The method according to claim 2, wherein said transmission lines comprise a coplanar structure.

5. The method according to claim 1, wherein said power splitter is electrically coupled to one or more capacitors in said integrated circuit.

6. The method according to claim 5, wherein said one or more capacitors comprise CMOS devices in said integrated circuit.

7. The method according to claim 1, wherein said power splitters comprise lumped devices.

8. The method according to claim 7, wherein said lumped devices comprise surface mount devices coupled to said multi-layer package.

9. The method according to claim 7, wherein said lumped devices comprise devices integrated in said integrated circuit.

10. The method according to claim 1, wherein said integrated circuit is flip-chip bonded to said multi-layer package.

11. A system for wireless communication, the system comprising:

a multilayer package bonded to an integrated circuit, wherein said multi-layer package comprises a power splitter that generates one or more RF signals whose power is proportional to a received RF signal; and

one or more circuits within said integrated circuit that processes said one or more generated RF signals.

12. The system according to claim 11, wherein said power splitter comprises quarter wavelength transmission lines or any integer multiple of quarter wavelength.

13. The system according to claim 12, wherein said transmission lines comprise a microstrip structure.

14. The system according to claim 12, wherein said transmission lines comprise a coplanar structure.

15. The system according to claim 11, wherein said power splitter is electrically coupled to one or more capacitors in said integrated circuit.

16. The system according to claim 15, wherein said one or more capacitors comprise CMOS devices in said integrated circuit.

17. The system according to claim 11, wherein said power splitters comprise lumped devices.

18. The system according to claim 17, wherein said lumped devices comprise surface mount devices coupled to said multi-layer package.

19. The system according to claim 17, wherein said lumped devices comprise devices integrated in said integrated circuit.

20. The system according to claim 11, wherein said integrated circuit is flip-chip bonded to said multi-layer package.