METHOD AND SYSTEM FOR CONFIGURING A TRANSFORMER EMBEDDED IN A MULTI-LAYER INTEGRATED CIRCUIT (IC) PACKAGE

• US 20090243767A1
• Filed: 03/28/2008
• Published: 10/01/2009
• Est. Priority Date: 03/28/2008
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Rofougaran, Ahmadreza
• Granted Patent: US 8,198,714 B2
• Time in Patent Office: Days
• US Class Current: 334/59
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 2021/125 Printed variable inductor with taps, e.g. for VCO
• CPC Class Codes: H01F 21/12 discontinuously variable, e.g. tapped
• CPC Class Codes: H01H 1/0036 Switches making use of microelectromechanical systems [MEMS] for electromagnetic relays H01H50/005; for electrostatic relays H01H59/0009
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/15321 being a ball array, e.g. BGA
• CPC Class Codes: H04B 17/318 Received signal strength
• CPC Class Codes: H04B 5/0087 with multiple coils at either side
• CPC Class Codes: H04B 5/0093 with one coil at each side, e.g. with primary and secondary coils
• CPC Class Codes: H04B 5/263 Multiple coils at either side
• CPC Class Codes: H04B 5/266 One coil at each side, e.g. with primary and secondary coils

Abstract

Aspects of a method and system for configuring a transformer embedded in a multi-layer integrated circuit package are provided. In this regard, a windings ratio of a transformer embedded in a multi-layer IC package bonded to an IC may be configured, via logic, circuitry, and/or code in the IC, based on signal levels at one or more terminals of the transformer. The transformer may comprise a plurality of inductive loops fabricated in transmission line media. The integrated circuit may be flip-chip bonded to the multi-layer package. The IC may comprise a signal strength indicator enabled to measure signal levels input to or output by the transformer. The windings ratio may be configured via one or more switches in the IC and/or in the multi-layer package. The IC and/or the multi-layer package may comprise ferromagnetic material which may improve magnetic coupling of the transformer.

Claims

1. A method for signal processing, the method comprising:

in a hybrid circuit comprising an integrated circuit flip-chip bonded to a multi-layer package, configuring a windings ratio of a transformer embedded in said multi-layer package based on signal levels at a winding of said transformer.

2. The method according to claim 1, comprising measuring said signal levels utilizing a signal strength indicator in said integrated circuit.

3. The method according to claim 1, wherein said winding is communicatively coupled to an output of an amplifier.

4. The method according to claim 1, wherein said winding is communicatively coupled to an input of an amplifier.

5. The method according to claim 1, comprising configuring said windings ratio of said transformer via one or more switching elements.

8. The method according to claim 1, wherein said transformer comprises a plurality of loops fabricated in a plurality of metal layers in said multi-layer integrated circuit package.

9. The method according to claim 8, wherein said loops are fabricated in transmission line media.

10. The method according to claim 1, wherein ferromagnetic material is embedded in said multi-layer package.

6. The method according to claim 6, wherein said one or more switching elements comprise microelectromechanical system (MEMS) switches within and/or on said multi-layer package.

7. The method according to claim 6, wherein said one or more switching elements comprise active devices fabricated within and/or on said integrated circuit.

11. A system for signal processing, the system comprising:

a hybrid circuit comprising an integrated circuit flip-chip bonded to a multi-layer package, wherein a transformer is embedded in said multi-layer package and said integrated circuit comprises one or more circuits, said one or more circuits enables configuration of a windings ratio of said transformer based on signal levels at a winding of said transformer.

12. The system according to claim 11, wherein said one or more circuits is enabled to measure said signal levels utilizing a signal strength indicator in said integrated circuit.

13. The system according to claim 11, wherein said winding is communicatively coupled to an output of an amplifier.

14. The system according to claim 11, wherein said winding is communicatively coupled to an input of an amplifier.

15. The system according to claim 11, wherein said one or more circuits enable configuration of said windings ratio of said transformer via one or more switching elements.

18. The system according to claim 11, wherein said transformer comprises a plurality of loops fabricated in a plurality of metal layers in said multi-layer integrated circuit package.

19. The system according to claim 18, wherein said loops are fabricated in transmission line media.

20. The system according to claim 11, wherein ferromagnetic material is embedded in said multi-layer package.

16. The system according to claim 16, wherein said one or more switching elements comprise microelectromechanical system (MEMS) switches within and/or on said multi-layer package.

17. The system according to claim 16, wherein said one or more switching elements comprise active devices fabricated within and/or on said integrated circuit.