Systems and Methods for Cooling a Computing Component in a Computing Rack
First Claim
1. A system for cooling computing components, comprising:
- a computing rack housing a plurality of computing components of a computing system;
a heat absorbing plate disposed in and being removable from the computing rack, the heat absorbing plate being thermally coupled to an outer surface of a computing component of the plurality of computing components, the heat absorbing plate comprising a plurality of walls defining a cavity containing a two-phase coolant, the cavity being a continuous volume allowing the two-phase coolant to absorb heat from the computing component and to transfer the heat to a heat transfer mechanism; and
a sidewall of the computing rack being thermally coupled to the heat absorbing plate and comprising the heat transfer mechanism, the heat transfer mechanism being operable to receive the heat transferred from the heat absorbing plate.
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Accused Products
Abstract
According to one embodiment, a system for cooling computing components includes a computing rack housing a plurality of computing components of a computing system. A heat absorbing plate is disposed in and removable from the computing rack. The heat absorbing plate is thermally coupled to an outer surface of a computing component and comprises a plurality of walls defining a cavity containing a two-phase coolant. The cavity has a continuous volume allowing the two-phase coolant to absorb heat from the computing component and to transfer the heat to a heat transfer mechanism. The computing rack has a sidewall that is thermally coupled to the heat absorbing plate and comprises the heat transfer mechanism, which is operable to receive the heat transferred from the heat absorbing plate.
136 Citations
22 Claims
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1. A system for cooling computing components, comprising:
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a computing rack housing a plurality of computing components of a computing system; a heat absorbing plate disposed in and being removable from the computing rack, the heat absorbing plate being thermally coupled to an outer surface of a computing component of the plurality of computing components, the heat absorbing plate comprising a plurality of walls defining a cavity containing a two-phase coolant, the cavity being a continuous volume allowing the two-phase coolant to absorb heat from the computing component and to transfer the heat to a heat transfer mechanism; and a sidewall of the computing rack being thermally coupled to the heat absorbing plate and comprising the heat transfer mechanism, the heat transfer mechanism being operable to receive the heat transferred from the heat absorbing plate. - View Dependent Claims (2, 3)
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4. A system for cooling computing components, comprising:
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a computing rack housing a plurality of computing components of a computing system; a heat absorbing plate disposed in the computing rack and being thermally coupled to an outer surface of a computing component of the plurality of computing components, the heat absorbing plate comprising a two-phase coolant operable to remove heat from the computing component; and a sidewall of the computing rack being thermally coupled to the heat absorbing plate and comprising a heat transfer mechanism operable to remove heat from the heat absorbing plate. - View Dependent Claims (5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method of cooling a computing component, comprising:
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providing an electronic heat generating component within a computing component, the computing component being contained within a computing rack; transferring heat generated by the electronic component to a base of the computing component; transferring the heat from the base to a heat absorbing plate containing a two-phase coolant, the heat vaporizing the coolant; transferring the heat from the heat absorbing plate to a heat transfer mechanism within a sidewall of the computing rack; and removing the heat from the computing rack by the heat transfer mechanism. - View Dependent Claims (17, 18, 19, 20, 21, 22)
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Specification