Electronic Device, Cooling Device and Loop Heat Pipe

• US 20090244846A1
• Filed: 01/06/2009
• Published: 10/01/2009
• Est. Priority Date: 03/27/2008
• Status: Active Grant

• Current Assignee: Toshiba Client Solutions CO., Ltd. (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Tomioka, Kentaro
• Granted Patent: US 7,652,885 B2
• Time in Patent Office: Days
• US Class Current: 361/700
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

According to one embodiment, an electronic device includes a housing, a heat generating part contained in the housing, and a loop heat pipe contained in the housing. The loop heat pipe includes a heat receiving portion, a heat radiating portion, a vapor flow path and a liquid return flow path. The heat receiving portion includes a first region connected to the liquid return flow path and provided with a wick, and a second region formed to be hollow, connected to the vapor flow path. The heat receiving portion is thermally connected to the heat generating part at a position across the first region and the second region.

Claims

1. An electronic device comprising:

a housing;

a heat generating part contained in the housing; and

a loop heat pipe contained in the housing, and comprises;

a heat receiving portion thermally connected to the heat generating part;

a heat radiating portion release the heat transmitted from the heat receiving portion to the outside;

a vapor flow path connected to the heat receiving portion, and transmitting the fluid evaporated by the heat receiving portion to the heat radiating portion; and

a liquid return flow path connected to the heat radiating portion, and transmitting the fluid to the heat receiving portion, and

the heat receiving portion further comprises a first region connected to the liquid return flow path and provided with a wick, and a second region formed to be hollow, connected to the vapor flow path, and thermally connected to the heat generating part at a position across the first region and the second region.

2. The electronic device of claim 1, wherein the wick is a porous material prepared by sintering metal powder.

3. The electronic device of claim 2, wherein the heat generating part comprises a plurality of heat generating parts, and the plurality of heat generating parts are arranged in line on a border line between the first region and the second region.

4. The electronic device of claim 3, wherein the wick is formed continuously to extend from the first region to an inside of the liquid return flow path.

5. The electronic device of claim 4, wherein the wick is formed continuously to extend from the first region to an inside of the heat radiating portion.

6. A cooling device comprising:

a loop heat pipe comprising a heat receiving portion and a head radiating portion;

a heat generating part thermally connected to the heat receiving portion;

a heat sink which promotes heat radiation in the heat radiating portion; and

a fan unit which supplies an air blow to the heat sink,

wherein the loop heat pipe further comprises;

the heat receiving portion thermally connected to the heat generating part;

the heat radiating portion which release the heat transmitted from the heat receiving portion to the outside;

a vapor flow path connected to the heat receiving portion, and transmitting the fluid evaporated by the heat receiving portion to the heat radiating portion; and

a liquid return flow path connected to the heat radiating portion, and transmitting the fluid to the heat receiving portion, and

the heat receiving portion further comprises a first region connected to the liquid return flow path and provided with a wick, and a second region formed to be hollow, connected to the vapor flow path, and thermally connected to the heat generating part at a position across the first region and the second region.

7. The cooling device of claim 6, wherein the wick is a porous material prepared by sintering metal powder.

8. The cooling device of claim 7, wherein the heat generating part comprises a plurality of heat generating parts, and the plurality of heat generating parts are arranged in line on a border line between the first region and the second region.

9. The cooling device of claim 8, wherein the wick is formed continuously to extend from the first region to an inside of the liquid return flow path.

10. The cooling device of claim 9, wherein the wick is formed continuously to extend from the first region to an inside of the heat radiating portion.

11. A loop heat pipe comprises:

a heat receiving portion thermally connected to a heat generating part;

a heat radiating portion release the heat transmitted from the heat receiving portion to the outside;

a vapor flow path connected to the heat receiving portion, and transmitting the fluid evaporated by the heat receiving portion to the heat radiating portion; and

a liquid return flow path connected to the heat radiating portion, and transmitting the fluid to the heat receiving portion, and

the heat receiving portion further comprises a first region connected to the liquid return flow path and provided with a wick, and a second region formed to be hollow, connected to the vapor flow path, and thermally connected to the heat generating part at a position across the first region and the second region.

12. The loop heat pipe of claim 11, wherein the wick is a porous material prepared by sintering metal powder.

13. The loop heat pipe of claim 12, wherein the wick is formed continuously to extend from the first region to an inside of the liquid return flow path.

14. The loop heat pipe of claim 13, wherein the wick is formed continuously to extend from the first region to an inside of the heat radiating portion.