Methods for Forming Roughened Surfaces and Applications thereof
First Claim
1. A method for forming a roughened surface on a substrate, comprising:
- depositing a metal oxide on the substrate; and
reducing the metal oxide at a temperature at which agglomeration occurs.
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Abstract
Methods of forming a roughened metal surface on a substrate are provided, along with structures comprising such roughened surfaces. In preferred embodiments roughened surfaces are formed by selectively depositing metal or metal oxide on a substrate surface to form discrete, three-dimensional islands. Selective deposition may be obtained, for example, by modifying process conditions to cause metal agglomeration or by treating the substrate surface to provide a limited number of discontinuous reactive sites. The roughened metal surface may be used, for example, in the manufacture of integrated circuits.
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Citations
11 Claims
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1. A method for forming a roughened surface on a substrate, comprising:
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depositing a metal oxide on the substrate; and reducing the metal oxide at a temperature at which agglomeration occurs. - View Dependent Claims (2, 3)
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4. A method for forming a capacitor in an integrated circuit (IC), comprising:
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providing a substrate in a reaction space; forming discrete three-dimensional islands conductive material comprising metal on a surface of the substrate; and depositing a layer of a high-k material over the islands. - View Dependent Claims (5, 6, 7)
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8. A method for forming a roughened surface on a substrate, comprising:
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forming a discontinuous surface termination on the substrate; forming catalyst nanoparticles on the surface of said substrate by atomic layer deposition (ALD); and depositing carbon nanotubes on said catalyst nanoparticles. - View Dependent Claims (9, 10, 11)
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Specification