METHOD AND SYSTEM FOR INTER-PCB COMMUNICATIONS WITH WIRELINE CONTROL
First Claim
1. A method for processing communication signals, the method comprising:
- setting up a microwave communication link between a first PCB and a second PCB via a wireline communication bus; and
communicating data between said first PCB and said second PCB via said microwave communication link.
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Accused Products
Abstract
Aspects of a method and system for inter-PCB communications with wireline control may include setting up a microwave communication link between a first PCB and a second PCB via a wireline communication bus. The initialization may comprise adjusting beamforming parameters of a first antenna array communicatively coupled to the first PCB, and of a second antenna array communicatively coupled to the second PCB. The first PCB and the second PCB may communicate data via the microwave communication link. The microwave communication link may be routed via one or more relay PCBs, when the first PCB and the second PCB cannot directly communicate satisfactorily. Control data may be transferred between the first PCB, the second PCB, and/or the one or more relay PCBs, which may comprise one or more antennas. The relay PCBs may be dedicated relay PCBs or multi-purpose transmitter/receivers.
72 Citations
24 Claims
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1. A method for processing communication signals, the method comprising:
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setting up a microwave communication link between a first PCB and a second PCB via a wireline communication bus; and communicating data between said first PCB and said second PCB via said microwave communication link. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A system for processing communication signals, the system comprising:
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one or more circuits in a first PCB and a second PCB communicatively coupled via a wireline communication bus, wherein said one or more circuits in said first PCB and/or said second PCB enable setup of a microwave communication link between said first PCB and said second PCB; and said one or more circuits in said first PCB and/or said second PCB enables communication of data between said first PCB and said second PCB via said microwave communication link. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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Specification