Method For Manufacturing Products Compricing Transponders

• US 20090249611A1
• Filed: 05/12/2006
• Published: 10/08/2009
• Est. Priority Date: 05/12/2006
• Status: Active Grant

• Current Assignee: Confidex Oy (Beontag)
• Original Assignee: Confidex Oy (Beontag)
• Inventors: Miettinen, Jarkko, Ahokas, Heikki, Ritamaki, Matti, Kytola, Lari, Hanhikorpi, Marko, Ikonen, Juha
• Granted Patent: US 7,971,336 B2
• Time in Patent Office: Days
• US Class Current: 29/601
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49018 with other electrical component
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

The present invention relates to a method for manufacturing products comprising transponders. The method comprises introducing a web comprising on its surface sequential structural modules comprising an impedance matching element and an integrated circuit electrically connected to the impedance matching element, the structural modules having a first distance between each other; cutting the web in such a manner that the sequential structural modules are separated from each other; attaching the structural modules to a product substrate, the sequential structural modules having a second distance between each other, the second distance being longer than the first distance; and attaching the impedance matching elements to antennas, the impedance matching elements and the antennas forming an electrical connection.

Claims

1. A method for manufacturing products comprising transponders, comprising

introducing a web comprising on its surface sequential structural modules comprising an impedance matching element and an integrated circuit electrically connected to the impedance matching element, the structural modules having a first distance between each other,

cutting the web in such a manner that the sequential structural modules are separated from each other,

attaching the structural modules to a product substrate, the sequential structural modules having a second distance between each other, the second distance being longer than the first distance, and

attaching the impedance matching elements to antennas, the impedance matching elements and the antennas forming an electrical connection.

2. The method according to claim 1, wherein the web comprises the structural modules next to each other in the cross direction of the web, the structural modules having a first cross-directional distance between each other, and the method comprises

cutting the web in such a manner that the structural modules next to each other are separated from each other, and

attaching the structural modules to a product substrate, the structural modules having a second cross-directional distance between each other, the second cross-directional distance being longer than the first cross-directional distance.

3. The method according to claim 1, wherein the electrical connection is a capacitive connection.

4. The method according to claim 1, wherein the electrical connection is an ohmic connection.

5. The method according to claim 1, wherein the impedance matching element is etched or printed.

6. The method according to claim 1, wherein the integrated circuit is on a silicon chip and the chip is attached to the impedance matching element by anisotropically conductive adhesive.

7. The method according to claim 1, wherein the integrated circuit is on a polymeric chip which is printed together with the impedance matching element in order to form a structural module.

8. The method according to claim 7, wherein the structural module comprising the polymeric chip is capacitively connected to the antenna.

9. The method according to claim 7, wherein the structural module comprising the polymeric chip is connected to the antenna by an ohmic contact which is formed by an electrically conductive paste.

10. The method according to claim 1, wherein the antenna is printed by an electrically conductive ink.

11. The method according to claim 1, wherein the antenna includes a metallic foil.

12. The method according to claim 1, wherein the intergrated circuit on the chip is attached to the impedance matching element via bumps, and the impedance matching element comprises loops which can be activated selectively by attaching the bumps to the selected loop.

13. The method according claim 1, wherein the integrated circuit on the chip is attached to the impedance matching element via at least two bumps, and the impedance matching element comprises a primary loop and a secondary loop, and the primary loop is activated when a bump is attached to the primary loop whereas the secondary loop is activated when a bump is attached to the secondary loop.

14. The method according to claim 1, wherein the impedance matching elements are formed on the surface of the web before attaching the chips on the same production line.

15. The method according to claim 1, the structural modules (1) are tested whether they work properly, and the inoperative structural modules (1) are removed before attaching to the product substrate.

16. The method according to claim 1, wherein the product substrate comprises a web form.