Electronic power converter and mounting structure of semiconductor device

• US 20090251859A1
• Filed: 06/04/2009
• Published: 10/08/2009
• Est. Priority Date: 08/21/2003
• Status: Active Grant

• Current Assignee: DENSO Corporation
• Original Assignee: DENSO Corporation
• Inventors: Ishiyama, Hiroshi, Harada, Daisuke
• Granted Patent: US 8,027,161 B2
• Time in Patent Office: Days
• US Class Current: 361/689
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/33181 On opposite sides of the body
• CPC Class Codes: H01L 23/4012 for stacked arrangements of a plurality of semiconductor devices assemblies per se H01L25/00
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Abstract

An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the semiconductor module, and having a control circuit; and a power wiring section connected to a main electrode terminal of the semiconductor module. The main circuit section is interposed between the control circuit substrate section and the power wiring section.

Claims

1. A mounting structure of a semiconductor device, the structure comprising:

a semiconductor module including a semiconductor element for supplying electricity, a first and a second electrode plates disposed on both sides of the semiconductor element, a connecting terminal connected to a control circuit for controlling the semiconductor element, and a resin mold having electric insulation for sealing the semiconductor element and the first and the second electrode plates; and

a metallic casing accommodating cooling medium having electric conductivity, wherein a plurality of the semiconductor modules is proximally disposed in the cooling medium of the casing, wherein

the first or second electrode plate, the cooling medium, a first or second mold portion of the resin mold provide a bypass capacitor for reducing noise.

2. The mounting structure of a semiconductor device according to claim 1, wherein the cooling medium is grounded.