SEMICONDUCTOR ACCELERATION SENSOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

• US 20090255340A1
• Filed: 06/24/2009
• Published: 10/15/2009
• Est. Priority Date: 06/18/2004
• Status: Active Grant

• Current Assignee: Oki Semiconductor Company Limited (ROHM Co., Ltd.)
• Original Assignee: Oki Semiconductor Company Limited (ROHM Co., Ltd.)
• Inventors: SHIZUNO, Yoshinori
• Granted Patent: US 7,788,976 B2
• Time in Patent Office: Days
• US Class Current: 73/514.330
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/123 by piezo-resistive elements, e.g. semiconductor strain gauges
• CPC Class Codes: G01P 15/18 in two or more dimensions
• CPC Class Codes: G01P 2015/0842 the mass being of clover leaf shape
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/1461 MEMS

Abstract

Although a weight part of an acceleration sensor chip fixed on a die pad is coated with a gelatinous resin part of low elasticity, the weight part is easily displaced by an external acceleration. Thus, an acceleration can be detected with accuracy. Furthermore, long-term reliability equal to those of regular resin packages is ensured because those portions of an acceleration sensor device which are not used for acceleration sensing are sealed with a resin part.

Claims

1. A semiconductor acceleration sensor device comprising:

an acceleration sensor chip including;

a weight part,

a support part which flexibly supports the weight part, one end of the support part being connected to the weight part, and

a pedestal part surrounding the weight part, an opposite end of the support part being connected to the pedestal part;

an elastic first resin part to coat and to entirely cover the weight part and the support part;

a circuit chip provided over the acceleration sensor chip and electrically connected to the acceleration sensor chip; and

a second resin part to encapsulated the first resin part, the acceleration sensor ship and the circuit chip.

2. The semiconductor acceleration sensor device according to claim 1 wherein the first resin extends between the acceleration sensor chip and the circuit chip.

3. The semiconductor acceleration sensor device according to claim 1 further comprising a wiring substrate provided on top of the circuit chip such that the wiring substrate is electrically connected to the circuit chip.

4. The semiconductor acceleration sensor device according to claim 1 further comprising a conductive part extending outward from the second resin.

5. The semiconductor acceleration sensor device according to claim 1 further comprising a bottom lid part attached to a lower face of the acceleration sensor ship.

6. The semiconductor acceleration sensor device according to the claim 1, wherein said circuit chip includes a semiconductor circuit chip.

7. The semiconductor acceleration sensor deice according to claim 1, wherein said first resin includes a gel element.

8. The semiconductor acceleration sensor device according to claim I wherein said second resin includes a thermoplastic resin.