Thermal Conducting Materials for Solar Panel Components

• US 20090255571A1
• Filed: 12/03/2008
• Published: 10/15/2009
• Est. Priority Date: 04/14/2008
• Status: Abandoned Application

• Current Assignee: BP Corporation North America Incorporated (BP PLC)
• Original Assignee: BP Corporation North America Incorporated (BP PLC)
• Inventors: Xia, Zhiyong, Cunningham, Daniel W.
• Application Number:
  US12/327,246
• Publication Number:
  US 20090255571A1
• Time in Patent Office: Days
• US Class Current: 136/251
• CPC Class Codes: B29C 70/70 Completely encapsulating inserts B29C70/86 takes precedence
• CPC Class Codes: B32B 17/10018 comprising only one glass sheet
• CPC Class Codes: B32B 17/10642 Thermally conductive agents
• CPC Class Codes: B32B 17/10788 containing ethylene vinylacetate
• CPC Class Codes: B32B 2457/12 Photovoltaic modules
• CPC Class Codes: C08J 5/124 using adhesives based on a macromolecular component
• CPC Class Codes: H01L 31/049 Protective back sheets
• CPC Class Codes: Y02E 10/50 Photovoltaic [PV] energy

Abstract

This invention relates to solar panels with improved encapsulants and backsheets for greater power output and/or increased efficiency by using materials with higher thermal conductivity than conventional solar panels. According to certain embodiments the improved materials include fillers while maintaining sufficient dielectric properties. According to certain other embodiments, the invention includes a solar panel with the improved encapsulant between solar cells and the improved backsheet. The invention also includes a method of making a solar panel including the improved materials.

Claims

1. A photovoltaic or semiconductor encapsulant, the encapsulant comprising:

a polymeric material; and

a filler material;

wherein the encapsulant has a thermal conductivity of about at least 0.26 watt per meter per Kelvin and a dielectric constant of about at least 2.0 measured at 60 hertz.

2. The encapsulant of claim 1, wherein the polymeric material is selected from the group consisting of ethylene vinyl acetate, polyurethane, polysilicone, polypropylene, polyethylene ionomers and combinations thereof.

3. The encapsulant of claim 1, wherein the polymeric material comprises a copolymer of ethylene and vinyl acetate including about 4 percent to about 90 percent vinyl acetate by weight.

4. The encapsulant of claim 1, wherein the filler material comprises glass fibers.

5. The encapsulant of claim 1, wherein the encapsulant comprises the filler material from about 0.1 percent to about 30 percent by volume.

6. The encapsulant of claim 1, further comprising at least one silane coupling agent for dispersing the filler material in the polymeric material or promoting adhesion of the encapsulant to other materials of a photovoltaic or a semiconductor.

7. The encapsulant of claim 6, wherein the at least one silane coupling agent comprises:

a first reactivity type selected from the group consisting of amino groups, epoxy groups, phenyl groups, vinyl groups, alkyl groups; and

a second reactivity type selected from the group consisting of methoxy reactivity groups, ethoxy reactivity groups and combinations thereof.

8. The encapsulant of claim 1, wherein the filler material is selected from the group consisting of aluminum nitride, calcium carbonate, calcium silicate, talc, barite, clay, titanium oxide, magnetite, aluminum oxide, silicon dioxide, boron nitride, silicon carbide and combinations thereof.

9. The encapsulant of claim 1, wherein the filler material has an average particle size of about 0.001 micrometers to about 1000 micrometers.

10. The encapsulant of claim 1, wherein the encapsulant forms pellets for additional processing.

11. The encapsulant of claim 1, wherein the encapsulant forms sheets or films.

12. The encapsulant of claim 1, wherein the filler material has an aspect ratio of equal to or greater than about 1.

13. The encapsulant of claim 1, wherein the filler material has an aspect ratio of at least about 5.

14. The encapsulant of claim 1, wherein the polymeric material comprises a chemical crosslinking agent.

15. The encapsulant of claim 1, wherein the encapsulant comprises a thermal diffusivity of at least 1.3×

10<sup>−

7</sup> meters squared per second.

16. The encapsulant of claim 1, wherein the thermal conductivity is measured at 30 degrees Celsius.

17. A photovoltaic or semiconductor backsheet, the backsheet comprising:

a polymeric material; and

a filler material;

wherein the backsheet has a dielectric constant of about at least 2.0 measured at 60 hertz and a higher thermal conductivity than the polymeric material in neat form.

18. The backsheet of claim 17, where the polymeric material is selected from the group consisting of polypropylene, polyethylene terephthalate, polyvinyl fluoride, polyvinylidene fluoride, polytetrafluoroethylene and combinations thereof.

19. The backsheet of claim 17, further comprising additional laminated layers including polyester, aluminum, polyvinyl fluoride, polyvinylidene fluoride and combinations thereof.

20. The backsheet of claim 17, wherein the backsheet comprises a multilayer material selected from the group consisting of polyvinyl fluoride-polyester-polyvinyl fluoride, polyvinyl fluoride-aluminum-polyvinyl fluoride, polyvinyl fluoride-aluminum-polyester, polypropylene, polyethylene terephthalate, polyvinyl fluoride, polyvinylidene fluoride, polytetrafluoroethylene and combinations thereof.

21. The backsheet of claim 17, wherein the filler material is selected from the group consisting calcium carbonate, calcium silicate, talc, barite, clay, rutile titanium oxide, anatase titanium oxide, magnetite, alumina, silicon dioxide, aluminum nitride, boron nitride, silicon carbide and combinations thereof.

22. A solar panel comprising a front layer and at least one photovoltaic cell, the panel comprising:

the front layer disposed with respect to a front side of the at least one photovoltaic cell;

an encapsulant contacting at least a portion of a back side of the at least one photovoltaic cell and disposed at least partially between the at least one photovoltaic cell and a backsheet, the encapsulant comprising a first polymeric material and a first thermal conducting filler material, the encapsulant having a thermal conductivity of about at least 0.26 watt per meter per Kelvin and a dielectric constant of about at least 2.0 measured at 60 hertz; and

the backsheet.

23. The solar panel of claim 22, wherein the backsheet comprises a second polymeric material and a second thermal conducting filler material, the backsheet having a dielectric constant of about at least 2.0 measured at 60 hertz and a higher thermal conductivity than the second polymeric material in neat form.

24. A solar panel of claim 22, wherein the backsheet comprises a glass sheet with a thermal conductivity of at least about 1.4 watt per meter per Kelvin.

25. The solar panel of claim 23, wherein:

the first polymeric material comprises ethylene vinyl acetate; and

the second polymeric material comprises polyethylene terephthalate.

26. The solar panel of claim 25, wherein the ethylene vinyl acetate comprises a copolymer of ethylene and vinyl acetate having about 4 percent to about 90 percent by weight vinyl acetate and a melt flow index of about 5 to about 40 grams per 10 minutes.

27. The solar panel of claim 22, further comprising at least one solar concentrator.

28. The solar panel of claim 22, wherein the at least one photovoltaic cell operates at least about 2.0 degrees Celsius cooler in direct overhead sunlight compared to a conventional photovoltaic cell or panel and operating in similar conditions.

29. The solar panel of claim 22, wherein the at least one photovoltaic cell produces at least about 0.5 percent more power in direct overhead sunlight compared to a conventional photovoltaic cell or panel and operating in similar conditions.

30. A process for making a solar panel comprising:

providing a front layer;

placing a first sheet of encapsulant material over at least a portion of the front layer;

placing at least one photovoltaic cell over the first sheet of encapsulant material;

placing a second sheet of encapsulant material over the at least one photovoltaic cell, the second sheet of encapsulant material comprising a first polymeric material and a first filler material, the second sheet of encapsulant material having a thermal conductivity of about at least 0.26 watt per meter per Kelvin and a dielectric constant of about at least 2.0 measured at 60 hertz;

placing a backsheet over the second sheet of encapsulant material, the backsheet comprising a second polymeric material and a second filler material, the backsheet having a dielectric constant of about at least 2.0 and a higher thermal conductivity than the second polymeric material in neat form; and

laminating the solar panel for a sufficient time and a sufficient temperature for sufficient crosslinking of the first sheet or the second sheet.

31. The process of claim 30, wherein laminating uses a vacuum to remove from the solar panel one selected from the group consisting of air, moisture, other volatiles and combinations thereof.

32. The process of claim 30, wherein the first sheet of encapsulant material differs from the second sheet of encapsulant material.