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Method of Creating Alignment/Centering Guides for Small Diameter, High Density Through-Wafer Via Die Stacking

  • US 20090255705A1
  • Filed: 04/11/2008
  • Published: 10/15/2009
  • Est. Priority Date: 04/11/2008
  • Status: Active Grant
First Claim
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1. A method of forming a die stack, comprising:

  • forming a plurality of through-wafer vias in a first die; and

    forming one or more alignment features in a first die.

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