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FOCUS RING, PLASMA ETCHING APPARATUS AND PLASMA ETCHING METHOD

  • US 20090255902A1
  • Filed: 06/25/2009
  • Published: 10/15/2009
  • Est. Priority Date: 11/15/2004
  • Status: Active Grant
First Claim
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1. A focus ring for use in a plasma etching apparatus for performing an etching by using a plasma on a surface of a substrate mounted on a susceptor in an airtight processing vessel, the focus ring being provided to surround a periphery of the substrate, comprising:

  • a lower step portion formed at an inner peripheral side of the focus ring; and

    an upper step portion surrounding the lower step portion,wherein a top surface of the upper step portion is divided into a first region at an inner side on the top surface of the upper step portion and a second region surrounding the first region, andwherein an average surface roughness Ra of the first region is small such that a reaction product produced during an etching processing is not captured to be deposited on a corresponding region and an average surface roughness Ra of the second region is large such that a reaction product is captured to be deposited on a corresponding region.

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