Method for Repairing Cracks in Components and Solder Material for Soldering Components

• US 20090255981A1
• Filed: 11/27/2006
• Published: 10/15/2009
• Est. Priority Date: 11/28/2005
• Status: Active Grant

• Current Assignee: Siemens AG
• Original Assignee: Siemens AG
• Inventors: Singer, Robert, Volek, Andreas
• Granted Patent: US 8,034,154 B2
• Time in Patent Office: Days
• US Class Current: 228/119
• CPC Class Codes: B23K 1/0018 Brazing of turbine parts
• CPC Class Codes: B23K 1/19 taking account of the properties of the materials to be soldered
• CPC Class Codes: B23K 2101/001 Turbines
• CPC Class Codes: B23K 35/0244 Powders, particles or spheres; Preforms made therefrom
• CPC Class Codes: B23K 35/3033 Ni as the principal constituent
• CPC Class Codes: B23K 35/304 with Cr as the next major constituent
• CPC Class Codes: B23K 35/3053 Fe as the principal constituent
• CPC Class Codes: B23P 6/007 using only additive methods, e.g. build-up welding
• CPC Class Codes: B23P 6/045 of turbine components, e.g. moving or stationary blades, rotors, etc.
• CPC Class Codes: C21D 9/50 for welded joints
• CPC Class Codes: C22C 19/05 with chromium
• CPC Class Codes: C22C 19/07 based on cobalt
• CPC Class Codes: C22F 1/10 of nickel or cobalt or alloys based thereon
• CPC Class Codes: F05B 2230/238 Soldering
• CPC Class Codes: F05B 2230/80 Repairing, retrofitting or upgrading methods

Abstract

The invention relates to a method for repairing components that consist of a superalloy. The method comprises the following steps: a solder material is applied to the repair site; the repair site with the applied solder material is heated until the latter melts; and the melted solder material is left to solidify. A powder blend, whose average composition corresponds to the component alloy constitutes the solder material, the blend comprising at least one elementary powder of the component alloy as one powder type and/or a pre-alloy of the component alloy.

Claims

1-21. -21. (canceled)

22. A method for repairing components which consist of a superalloy having a directional microstructure such that a repaired site likewise has a directional microstructure, comprising:

applying a solder material to the site to be repaired, wherein the solder material is a powder mixture whose average composition corresponds to the alloy of the component and which comprises at least as one powder type an elementary powder of the alloy of the component or a prealloy of the alloy of the component;

heating the site to be repaired and the applied solder material till the solder material melts; and

solidifying the molten solder material.

23. The method as claimed in claim 22, wherein the solder material is composed exclusively of elementary powders, that respectively consist of one element of the alloy of the component.

24. The method as claimed in claim 22, wherein the solder material comprises a powder of a prealloy, which contains alloy constituents of the alloy of the component.

25. The method as claimed in claim 24, wherein the superalloy is a nickel-, cobalt- or iron-based superalloy.

26. The method as claimed in claim 25, wherein the molten solder material solidifies under constant temperature conditions.

27. The method as claimed in claim 26, wherein the molten solder material solidifies with the use of a temperature gradient.

28. The method as claimed in claim 27, wherein the temperature gradient is aligned such that the gradient extends in the direction in which epitaxial growth is intended to be induced in the region of the site to be repaired.

29. The method as claimed in claim 28, wherein the temperature gradient is provided by an optical, inductive or electron beam heating method, where the heat source and the component are moved relative to one another.

30. A solder material for soldering superalloy components having a directional microstructure, comprising:

a powder mixture having an average composition corresponding to the composition of the component alloy, where a powder of the mixture is an elementary powder and/or a pre-alloy of the component alloy.

31. The solder material as claimed in claim 30, wherein the mixture contains a superalloy powder.

32. The solder material as claimed in claim 31, wherein the mixture contains only one prealloy powder where the chemical composition corresponds to no superalloy or no alloy of the component.

33. The solder material as claimed in claim 30, wherein the mixture is composed exclusively of elementary powders which respectively consist of one element of the alloy of the component.

34. The solder material as claimed in claim 31, wherein the mixture consists of an elementary powder of a superalloy and a superalloy powder.

35. The solder material as claimed in claim 32, which contains an elementary powder and a prealloy of the component.

36. The solder material as claimed in claim 32, wherein the mixture contains a first prealloy and a second prealloy of the component and the average compositions of the first prealloy and the second prealloy correspond to a composition of an alloy of the component.

37. The solder material as claimed in claim 32, further comprising a superalloy powder, a first prealloy and a second prealloy of the component,

the average compositions of the first prealloy and the second prealloy corresponding to the composition of the alloy of the component.

38. The solder material as claimed in claim 32, further comprising a superalloy powder, a prealloy of the component and an elementary powder,

the average compositions of the prealloy powder and the elementary powder corresponding to the composition of the alloy of the component.

39. The solder material as claimed in claim 38, wherein the superalloy is a nickel-, cobalt- or iron-based superalloy.