LEDs using single crystalline phosphor and methods of fabricating same
First Claim
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1. A method for fabricating light emitting diode (LED) chips from a wafer, comprising:
- depositing LED epitaxial layers on an LED growth wafer to form a plurality of LEDs on said growth wafer; and
bonding a single crystalline phosphor over at least some said plurality of LEDs so that at least some light from the covered ones of said LEDs passes through said single crystalline phosphor and is converted.
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Abstract
Methods for fabricating LED chips from a wafer and devices fabricated using the methods with one method comprising depositing LED epitaxial layers on an LED growth wafer to form a plurality of LEDs on the growth wafer. A single crystalline phosphor is bonded over at least some the plurality of LEDs so that at least some light from the covered LEDs passes through the single crystalline phosphor and is converted. The LED chips can then be singulated from the wafer to provide LED chips each having a portion of said single crystalline phosphor to convert LED light.
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Citations
61 Claims
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1. A method for fabricating light emitting diode (LED) chips from a wafer, comprising:
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depositing LED epitaxial layers on an LED growth wafer to form a plurality of LEDs on said growth wafer; and bonding a single crystalline phosphor over at least some said plurality of LEDs so that at least some light from the covered ones of said LEDs passes through said single crystalline phosphor and is converted. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A light emitting diode (LED) chip wafer, comprising:
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a plurality of LEDs on a wafer; a first single crystalline phosphor at least partially covering at least some of said LEDs such that during operation of the covered ones of said LEDs at least some light from said LEDs passes through said single crystalline phosphor and is converted. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31)
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32. A light emitting diode (LED) chip, comprising:
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an LED; and a single crystalline on and at least partially covering said LED so that at least some of the light emitted by said LED is converted by said single crystalline phosphor. - View Dependent Claims (33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46)
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47. A light emitting diode (LED) package comprising:
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an LED chip, comprising an LED and a single crystalline phosphor at least partially covering said LED and converting at least some of the light from said LED, and first and second contacts for applying an electrical signal to said LED; package leads in electrical connection with said first and second contacts; and encapsulation surrounding said LED chip and electrical connections. - View Dependent Claims (48, 49, 50, 51, 52)
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53. A method for fabricating light emitting diode (LED) chips from a wafer, comprising:
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depositing LED epitaxial layers on an LED growth substrate to form an LED wafer with a plurality of LEDs; bonding said LED wafer to a carrier wafer; removing said LED growth substrate; bonding a single crystalline phosphor over at least some of said plurality of LEDs so that light from at least some of said LEDs passes through said single crystalline phosphor and is converted; and removing said carrier wafer. - View Dependent Claims (54, 55, 56, 57, 58, 59, 60, 61)
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Specification