SEMICONDUCTOR DEVICE PACKAGES WITH ELECTROMAGNETIC INTERFERENCE SHIELDING
First Claim
1. A semiconductor device package, comprising:
- a substrate unit includingan upper surface,a lower surface,a lateral surface disposed adjacent to a periphery of the substrate unit and extending between the upper surface and the lower surface of the substrate unit, the lateral surface of the substrate unit being substantially planar, anda grounding element disposed adjacent to the periphery of the substrate unit, the grounding element corresponding to a remnant of an internal grounding via and including a connection surface that is electrically exposed adjacent to the lateral surface of the substrate unit;
a semiconductor device disposed adjacent to the upper surface of the substrate unit and electrically connected to the substrate unit;
a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device, the package body including exterior surfaces that include a lateral surface, the lateral surface of the package body being substantially aligned with the lateral surface of the substrate unit; and
an electromagnetic interference shield disposed adjacent to the exterior surfaces of the package body and electrically connected to the connection surface of the grounding element,wherein the grounding element provides an electrical pathway to ground electromagnetic emissions incident upon the electromagnetic interference shield.
1 Assignment
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Accused Products
Abstract
Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a substrate unit including a grounding element; (2) a semiconductor device disposed adjacent to an upper surface of the substrate unit; (3) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device; and (4) an EMI shield disposed adjacent to exterior surfaces of the package body and electrically connected to a connection surface of the grounding element. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit, and the connection surface of the grounding element is electrically exposed adjacent to the lateral surface of the substrate unit. The grounding element corresponds to a remnant of an internal grounding via, and provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield.
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Citations
20 Claims
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1. A semiconductor device package, comprising:
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a substrate unit including an upper surface, a lower surface, a lateral surface disposed adjacent to a periphery of the substrate unit and extending between the upper surface and the lower surface of the substrate unit, the lateral surface of the substrate unit being substantially planar, and a grounding element disposed adjacent to the periphery of the substrate unit, the grounding element corresponding to a remnant of an internal grounding via and including a connection surface that is electrically exposed adjacent to the lateral surface of the substrate unit; a semiconductor device disposed adjacent to the upper surface of the substrate unit and electrically connected to the substrate unit; a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device, the package body including exterior surfaces that include a lateral surface, the lateral surface of the package body being substantially aligned with the lateral surface of the substrate unit; and an electromagnetic interference shield disposed adjacent to the exterior surfaces of the package body and electrically connected to the connection surface of the grounding element, wherein the grounding element provides an electrical pathway to ground electromagnetic emissions incident upon the electromagnetic interference shield. - View Dependent Claims (2, 3, 4, 5)
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- 6. The semiconductor device package of claim I, wherein the electromagnetic interference shield includes a lateral portion that extends along the lateral surface of the substrate unit.
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8. A semiconductor device package, comprising:
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a substrate unit including a first surface, a second opposing surface, an electrically conductive layer disposed between the first surface and the second opposing surface of the substrate unit, and a grounding element extending between the electrically conductive layer and the second opposing surface of the substrate unit, the grounding element including a lateral surface disposed adjacent to a periphery of the substrate unit; a semiconductor device disposed adjacent to the first surface of the substrate unit and electrically connected to the substrate unit; a package body disposed adjacent to the first surface of the substrate unit and covering the semiconductor device, the package body including exterior surfaces; and an electromagnetic interference shield disposed adjacent to the exterior surfaces of the package body and electrically connected to the lateral surface of the grounding element, wherein a lateral profile of the semiconductor device package is substantially planar and is substantially orthogonal with respect to the second opposing surface of the substrate unit. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16)
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17. A method of forming a semiconductor device package, comprising:
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providing a substrate including an upper surface, a lower surface, and grounding vias partially extending between the upper surface and the lower surface of the substrate, such that a height of each of the grounding vias is less than a thickness of the substrate; electrically connecting a semiconductor device to the upper surface of the substrate; applying a molding material to the upper surface of the substrate to form a molded structure covering the semiconductor device; forming cutting slits extending through the molded structure and the substrate, the cutting slits being aligned with the substrate, such that, (a) the substrate is sub-divided to form a substrate unit;
(b) the molded structure is sub-divided to form a package body disposed adjacent to the substrate unit, the package body including exterior surfaces; and
(c) remnants of the grounding vias correspond to grounding elements disposed adjacent to a periphery of the substrate unit, each of the grounding elements including an exposed connection surface; andapplying an electromagnetic interference coating to the exterior surfaces of the package body and the connection surfaces of the grounding elements to form an electromagnetic interference shield. - View Dependent Claims (18, 19, 20)
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Specification