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METHOD AND SYSTEM FOR PACKAGING A MEMS DEVICE

  • US 20090257109A1
  • Filed: 04/14/2009
  • Published: 10/15/2009
  • Est. Priority Date: 09/27/2004
  • Status: Active Grant
First Claim
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1. A display device, comprising:

  • an array of interferometric modulators disposed on a first surface of a transparent substrate;

    a carrier sealed to said transparent substrate to form a package encapsulating the interferometric modulator array; and

    an outer device shell, wherein the carrier is disposed within the outer device shell, and wherein the rigidity of the carrier is greater than the rigidity of the outer device shell.

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