METHOD AND SYSTEM FOR PACKAGING A MEMS DEVICE
First Claim
Patent Images
1. A display device, comprising:
- an array of interferometric modulators disposed on a first surface of a transparent substrate;
a carrier sealed to said transparent substrate to form a package encapsulating the interferometric modulator array; and
an outer device shell, wherein the carrier is disposed within the outer device shell, and wherein the rigidity of the carrier is greater than the rigidity of the outer device shell.
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Abstract
A MEMS-based display device is described, wherein an array of interferometric modulators are configured to reflect light through a transparent substrate. The transparent substrate is sealed to a backplate and the backplate can contain electronic circuitry for controlling the array of interferometric modulators. The backplate can provide physical support for device components, such as electronic components which can be used to control the state of the display. The backplate can also be utilized as a primary structural support for the device.
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Citations
15 Claims
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1. A display device, comprising:
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an array of interferometric modulators disposed on a first surface of a transparent substrate; a carrier sealed to said transparent substrate to form a package encapsulating the interferometric modulator array; and an outer device shell, wherein the carrier is disposed within the outer device shell, and wherein the rigidity of the carrier is greater than the rigidity of the outer device shell. - View Dependent Claims (2, 3)
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4. A display device, comprising:
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a carrier, said carrier comprising a first surface; a transparent substrate sealed to the first surface of the carrier to form a sealed package; an array of interferometric modulators disposed on said transparent substrate and sealed within said package; and an ancillary device component disposed on said first surface of the carrier. - View Dependent Claims (5, 6, 7, 8, 9, 10)
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11. A display device, comprising:
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an array of interferometric modulators disposed on a first surface of a transparent substrate; a carrier, wherein a first surface of said carrier is sealed to said first surface of the transparent substrate to form a package encapsulating the interferometric modulator array, wherein a surface area of the first surface of the carrier is larger than a surface area of the first surface of the transparent substrate; and an ancillary device component, wherein said ancillary device component is disposed on a second surface of said carrier, and wherein the carrier comprises electrical feedthroughs extending through the carrier. - View Dependent Claims (12, 13, 14, 15)
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Specification