Semiconductor package and associated methods

• US 20090257209A1
• Filed: 04/13/2009
• Published: 10/15/2009
• Est. Priority Date: 04/14/2008
• Status: Abandoned Application

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Han, Seong-Chan, Yang, Jin-Kyu, Lee, Dong-Chun, Chun, Kwang-Ho
• Application Number:
  US12/385,575
• Publication Number:
  US 20090257209A1
• Time in Patent Office: Days
• US Class Current: 361/772
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H05K 1/112 directly combined with via connections
• CPC Class Codes: H05K 2201/09472 Recessed pad for surface mounting recess in pad H05K2201/09745; Recessed electrode of component
• CPC Class Codes: H05K 2201/09509 Blind vias, i.e. vias having one side closed
• CPC Class Codes: H05K 2201/09572 Solder filled plated through-hole in the final product soldering lead-in-hole components H05K3/3447
• CPC Class Codes: H05K 2201/10666 Plated through-hole for surface mounting on PCB
• CPC Class Codes: H05K 2203/0455 PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: H05K 3/429 Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A semiconductor package and associated methods, the semiconductor package including a substrate including a socket, and connection terminals including a solder ball and a supporting portion extending from the solder ball into the socket.

Claims

1. A semiconductor package, comprising:

a substrate including a socket; and

a connection terminal including a solder ball and a supporting portion extending from the solder ball into the socket.

2. The semiconductor package as claimed in claim 1, wherein the socket includes a groove defined by a sidewall and a bottom surface or a hole penetrating the substrate.

3. The semiconductor package as claimed in claim 1, wherein the substrate includes a multi-layered substrate including a stacked insulating layer and an internal interconnection or a printed circuit board including an internal interconnection.

4. The semiconductor package as claimed in claim 3, wherein at least one connection terminal is electrically isolated from the internal interconnection, and at least one other connection terminal is electrically connected to the internal interconnection.

5. A semiconductor package, comprising:

a substrate including a first socket on a first side of the substrate and a second socket on a second side facing the first side;

a first connection terminal including a first solder ball and a first supporting portion extending from the first solder ball into the first socket; and

a second connection terminal including a second solder ball and a second supporting portion extending from the second solder ball into the second socket.

6. The semiconductor package as claimed in claim 5, wherein the first and second sockets include a groove defined by a sidewall and a bottom surface respectively.

7. The semiconductor package as claimed in claim 5, wherein the first and second sockets are defined by a hole penetrating the substrate, and the first supporting portion is connected to the second supporting portion in the hole.

8. The semiconductor package as claimed in claim 7, further comprising:

an insulating member interposing between the first supporting portion and the second supporting portion in the hole and the insulating member isolating the first connection terminal and the second connection terminal electrically.

9. A semiconductor package, comprising:

a printed circuit board including internal interconnections and sockets;

at least one package substrate facing the printed circuit board; and

connection terminals between the printed circuit board and the package substrate, each of the connection terminals including a supporting portion, the supporting portion being disposed within one of the sockets.

10. The semiconductor package as claimed in claim 9, wherein at least some of the sockets include a groove defined by a sidewall and a bottom surface or a hole penetrating the substrate.

11. The semiconductor package as claimed in claim 10, wherein the connection terminals include support terminals and signal terminals,

the support terminals are electrically isolated from the internal interconnections, and

the signal terminals are electrically connected to the internal interconnections, the printed circuit board, and the package substrate.

12. The semiconductor package as claimed in claim 11, wherein the support terminals are disposed at an edge region of the package substrate.

13. The semiconductor package as claimed in claim 12, wherein the support terminals are disposed at a corner region of the edge region of the package substrate.

14. The semiconductor package as claimed in claim 9, wherein:

the sockets include holes penetrating the substrate,

the package substrate includes;

a first package substrate on which a first semiconductor chip is mounted, the first package substrate coupled to a first side of the printed circuit board, and

a second package substrate on which a second semiconductor chip is mounted, the second package substrate coupled to a second side of the printed circuit board, and

the connection terminals include;

first connection terminals between the printed circuit board and the first package substrate, each of the first connection terminals corresponding to a socket; and

second connection terminals between the printed circuit board and the second package substrate, each of the second connection terminals corresponding to a socket,

wherein a first connection terminal corresponding to a socket is electrically connected to a second connection terminal corresponding to the same socket.

15. The semiconductor package as claimed in claim 9, wherein:

the sockets include holes penetrating the substrate and insulating members in the holes,

the package substrate includes;

a first package substrate on which a first semiconductor chip is mounted, the first package substrate coupled to a first side of the printed circuit board, and

a second package substrate on which a second semiconductor chip is mounted, the second package substrate coupled to a second side of the printed circuit board, and

the connection terminals include;

first connection terminals between the printed circuit board and the first package substrate, each of the first connection terminals corresponding to a socket, and

second connection terminals between the printed circuit board and the second package substrate, each of the second connection terminals corresponding to a socket,

wherein a first connection terminal corresponding to a socket is electrically isolated by the insulating member from a second connection terminal corresponding to the same socket.

16-21. -21. (canceled)