SEMICONDUCTOR DEVICE
First Claim
1. A semiconductor device comprising:
- a first assembly including;
a first semiconductor chip,a high-voltage bus bar that is bonded to one surface of the first semiconductor chip and that has a high-voltage terminal,a first metal wiring board that is connected to another surface of the first semiconductor chip using a bonding wire, anda third metal wiring board that is linked to the first metal wiring board, is separated by a prescribed interval from the bonding wire connected to the other surface of the first semiconductor chip, and is positioned parallel to the high-voltage bus bar;
a second assembly including;
a second semiconductor chip,a low-voltage bus bar that is connected to one surface of the second semiconductor chip using a bonding wire and that has a low-voltage terminal,a second metal wiring board that is bonded to another surface of the second semiconductor chip, anda fourth metal wiring board that is linked by being bent from an end portion of the second metal wiring board, is separated by a prescribed interval from the bonding wire connected to the second semiconductor chip, and is positioned parallel to the second metal wiring board; and
an output bus bar having an output terminal extending from each end portion of the third metal wiring board and of the fourth metal wiring board,wherein the first assembly and the second assembly are positioned in separated, layered structures, and the output bus bar is positioned between the layered structures.
1 Assignment
0 Petitions
Accused Products
Abstract
A semiconductor device includes first and second assembled bodies (12A, 12B). The first assembled body is provided with a first semiconductor chip, a high voltage bus bar (21) connected to one surface of the first semiconductor chip, a first metal wiring board (24-1) connected to the other surface of the first semiconductor chip with a bonding wire, and a third metal wiring board (24-3) connected to the first metal wiring board. The second assembled body is provided with a second semiconductor chip, a low voltage bus bar (23) connected to one surface of the second semiconductor chip with a bonding wire, a second metal wiring board (24-2) connected to the other surface of the second semiconductor chip, and a fourth metal wiring board (24-4) connected by being returned from an end portion of the second metal wiring board and arranged in parallel to the second metal wiring board. The first assembled body and the second assembled body are arranged in a stacked structure wherein the assembled bodies are being separated. Inductance of a main circuit is reduced by the semiconductor module structure.
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Citations
11 Claims
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1. A semiconductor device comprising:
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a first assembly including; a first semiconductor chip, a high-voltage bus bar that is bonded to one surface of the first semiconductor chip and that has a high-voltage terminal, a first metal wiring board that is connected to another surface of the first semiconductor chip using a bonding wire, and a third metal wiring board that is linked to the first metal wiring board, is separated by a prescribed interval from the bonding wire connected to the other surface of the first semiconductor chip, and is positioned parallel to the high-voltage bus bar; a second assembly including; a second semiconductor chip, a low-voltage bus bar that is connected to one surface of the second semiconductor chip using a bonding wire and that has a low-voltage terminal, a second metal wiring board that is bonded to another surface of the second semiconductor chip, and a fourth metal wiring board that is linked by being bent from an end portion of the second metal wiring board, is separated by a prescribed interval from the bonding wire connected to the second semiconductor chip, and is positioned parallel to the second metal wiring board; and an output bus bar having an output terminal extending from each end portion of the third metal wiring board and of the fourth metal wiring board, wherein the first assembly and the second assembly are positioned in separated, layered structures, and the output bus bar is positioned between the layered structures. - View Dependent Claims (2, 3, 4, 5, 10, 11)
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6. A semiconductor device comprising:
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a first assembly having a first semiconductor chip, a high-voltage bus bar that is bonded to one surface of the first semiconductor chip and that has a high-voltage terminal, and a first metal wiring board that is bonded to another surface of the first semiconductor chip; a second assembly having a second semiconductor chip, a low-voltage bus bar that is bonded to one surface of the second semiconductor chip and that has a low-voltage terminal, and a second metal wiring board that is bonded to another surface of the second semiconductor chip; and an output bus bar having an output terminal extending from each end portion of the first metal wiring board and of the second metal wiring board, wherein the first assembly and the second assembly are positioned in separated, layered structures, and the output bus bar is positioned between the layered structures. - View Dependent Claims (7, 8, 9)
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Specification