Sensor Chip and Sensor Chip Production Method
First Claim
1. A sensor chip comprising:
- a substrate,a cover layer,a spacer layer sandwiched between the substrate and the cover layer,multiple hollow reaction portions disposed between the substrate and the cover layer,multiple detection units exposed in the hollow reaction portions, whereina sample inlet is communicated with the hollow reaction portions.
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Abstract
It is intended to provide a sensor chip which has a small size and is easily produced and capable of determining quantities of at least two components of multiple samples rapidly, conveniently, and correctly as well as to provide a production method capable of producing the sensor chip easily and with high productivity.
A sensor chip includes a substrate, a cover layer, a spacer layer sandwiched between the substrate and the cover layer, multiple reaction portions disposed between the substrate and the cover layer, multiple detection units exposed in the hollow reaction portions, and a sample inlet communicated with the hollow reaction portions and a method for producing the sensor chip.
A sensor chip includes two substrates opposed to each other, a spacer layer sandwiched between the substrates, and multiple measurement units disposed between the substrates and including two or more hollow reaction portions that share one sample inlet opened on outer surfaces of the substrates and detection electrode units respectively exposed in the hollow reaction portions and a method for producing the sensor chip.
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Citations
18 Claims
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1. A sensor chip comprising:
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a substrate, a cover layer, a spacer layer sandwiched between the substrate and the cover layer, multiple hollow reaction portions disposed between the substrate and the cover layer, multiple detection units exposed in the hollow reaction portions, wherein a sample inlet is communicated with the hollow reaction portions. - View Dependent Claims (2, 3, 4, 5, 18)
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6. A sensor chip comprising:
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two substrates opposed to each other, a spacer layer sandwiched between the substrates, and multiple measurement units disposed between the substrates, and including two or more hollow reaction portions that share one sample inlet opened on outer surfaces of the substrates and detection electrode units respectively exposed in the hollow reaction portions. - View Dependent Claims (7, 8, 9, 10)
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11. A method for producing a sensor chip including a substrate, a cover layer, a spacer layer sandwiched between the substrate and the cover layer, a multiplicity of hollow reaction portions disposed between the substrate and the cover layer, a multiplicity of detection units exposed in the hollow reaction portions, wherein a sample inlet is communicated with the hollow reaction portions,
the method comprising: -
a step of forming the multiple detection units on the substrate, a step of forming the spacer layer having multiple grooves in which the detection units are respectively exposed and having one ends thereof disposed on a substantially identical position, and a lamination step for covering the spacer layer with the cover layer. - View Dependent Claims (12, 13, 14)
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15. A method for producing a sensor chip including two opposed substrates, a spacer layer sandwiched between the substrates, and multiple measurement unit including two or more hollow reaction portions sharing one sample inlet opened on outer surfaces of the substrates and detection electrode units respectively exposed in the hollow reaction portions,
the method comprising: -
a step of forming the multiple detection electrode units on each of two parts that are sectioned by a folding line at which the substrate sheet is substantially bisected; a step of covering the detection electrode units with a member forming the spacer layer and forming the multiple grooves in which the detection electrode units are respectively exposed in such a manner that one ends of the grooves are shared by the grooves or that one ends of the grooves are disposed line-symmetrically about a central axis which is the folding line; and a step of folding the member to laminate surfaces of one part of the member and the other part of the member by the folding. - View Dependent Claims (16, 17)
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Specification