Sub-Mount, light emitting diode package and manufacturing method thereof

• US 20090261356A1
• Filed: 10/01/2008
• Published: 10/22/2009
• Est. Priority Date: 04/17/2008
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Lee, Young-Ki, Shin, Sang-Hyun, Jeon, Hyung-Jin, choi, Seog-Moon
• Granted Patent: US 7,960,806 B2
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/641 characterized by the materials
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

A sub-mount, a light emitting diode package, and a method of manufacturing thereof are disclosed. A sub-mount, on which multiple light emitting diodes are mounted, can include a multiple number of metal bodies on which the light emitting diodes are respectively mounted, and an oxide wall interposed between the metal bodies such that the adjacent metal bodies are supported by each other but electrically disconnected from each other. By utilizing certain embodiments of the invention, a high heat releasing effect may be obtained, and manufacturing costs may be reduced.

Claims

1. A sub-mount having a plurality of light emitting diodes mounted thereon, the sub-mount comprising:

a plurality of metal bodies having the plurality of light emitting diodes respectively mounted thereon; and

an oxide wall interposed between the metal bodies such that the adjacent metal bodies are supported by each other and electrically disconnected from each other.

2. The sub-mount of claim 1, wherein the metal body is made from a material containing aluminum, and

the oxide wall is made from a material containing aluminum oxide.

3. The sub-mount of claim 1, further comprising:

an oxide layer formed on a lower surface of the plurality of metal bodies and the oxide wall.

4. A light emitting diode package including a plurality of light emitting diodes, the light emitting diode package comprising:

a substrate having a cavity formed therein;

a sub-mount inset in the cavity; and

a plurality of light emitting diodes mounted on the sub-mount,

wherein the sub-mount comprises;

a plurality of metal bodies having the plurality of light emitting diodes respectively mounted thereon; and

an oxide wall interposed between the metal bodies such that the adjacent metal bodies are supported by each other and electrically disconnected from each other.

5. The light emitting diode package of claim 4, wherein the metal body is made from a material containing aluminum, and

the oxide wall is made from a material containing aluminum oxide.

6. The light emitting diode package of claim 4, further comprising:

an oxide layer formed on a lower surface of the plurality of metal bodies and the oxide wall.

7. The light emitting diode package of claim 4, wherein the light emitting diode has one of a cathode and an anode contacting the metal body.

8. A method of manufacturing a light emitting diode package including a plurality of light emitting diodes, the method comprising:

forming a sub-mount by selectively oxidizing a metal plate, the sub-mount comprising a plurality of metal bodies electrically disconnected by at least one oxide wall;

mounting the light emitting diodes on the metal bodies respectively; and

mounting the sub-mount in a substrate having a cavity formed therein.

9. The method of claim 8, wherein the metal plate is made from a material containing aluminum.

10. The method of claim 8, wherein the light emitting diode has one of a cathode and an anode contacting the metal body.

11. The method of claim 8, further comprising:

forming an oxide layer by oxidizing a lower surface of the metal plate.