Optoelectronic Componet Which Emits Electromagnetic Radiation, and Method for Production of an Optoelectronic Component

• US 20090261365A1
• Filed: 09/22/2006
• Published: 10/22/2009
• Est. Priority Date: 09/30/2005
• Status: Active Grant

• Current Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Petersen, Kirstin, Brunner, Herbert
• Granted Patent: US 8,476,655 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/52 Encapsulations

Abstract

An optoelectronic component comprising a housing and a luminescence diode chip arranged in the housing is specified, which component emits a useful radiation. The housing has a housing material which is transmissive to the useful radiation and which is admixed with radiation-absorbing particles in a targeted manner for setting a predetermined radiant intensity or luminous intensity of the emitted useful radiation. The radiation-absorbing particles reduce the radiant intensity or the luminous intensity by a defined value in a targeted manner in order thus to set a predetermined radiant intensity or luminous intensity for the component. A method for producing an optoelectronic component of this type is additionally disclosed.

Claims

1. An optoelectronic component which emits a useful radiation, comprising a housing and a luminescence diode chip arranged in the housing,

wherein

the housing has a housing material which is transmissive to the useful radiation and which is admixed with radiation-absorbing particles in a targeted manner for setting a predetermined radiant intensity or luminous intensity of the emitted useful radiation.

2. The optoelectronic component according to claim 1,

wherein

the radiation-absorbing particles are absorbent for the entire wavelength spectrum of the useful radiation.

3. The optoelectronic component according to claim 1, wherein

the radiation-absorbing particles are absorbent for the entire wavelength spectrum of the radiation emitted by the luminescence diode chip during the operation thereof.

4. The optoelectronic component according to claim 1, wherein

the housing material which is transmissive to the useful radiation has a casting composition or moulding composition.

5. The optoelectronic component according to claim 1, wherein

the housing material which is transmissive to the useful radiation has at least one of the materials from the group comprising epoxy resin, acrylate, silicone, thermoplastic and hybrid material with at least one of said materials.

6. The optoelectronic component according to claim 1, wherein

the luminescence diode chip is encapsulated or surrounded by the housing material which is transmissive to the useful radiation.

7. The optoelectronic component according to claim 1, wherein

the housing material which is transmissive to the useful radiation has at least one phosphor.

8. The optoelectronic component according to claim 1, wherein

the radiation-absorbing particles have carbon black.

9. The optoelectronic component according to claim 7,

wherein

the carbon black is an industrial carbon black with a compact aggregate structure (LSCB, “

low structure carbon black”

).

10. Optoelectronic component according to claim 1, wherein

the radiation-absorbing particles have an average particle diameter of less than or equal to 100 nm.

11. The optoelectronic component according to claim 1, wherein

the absorption coefficient of the radiation-absorbing particles varies by less than 10% in the entire spectrum of the useful radiation.

12. The optoelectronic component according to claim 1, wherein

the component has a housing basic body with a housing cavity in which the luminescence diode chip is mounted and which is at least partly filled with the housing material which is transmissive to the useful radiation.

13. The optoelectronic component according to claim 1, wherein

the component has a housing body and the housing material which is transmissive to the useful radiation is applied on an exterior area of the housing body.

14. The optoelectronic component according to claim 13,

wherein

the housing material which is transmissive to the useful radiation is applied in the form of a foil on the exterior area of the housing body.

15. A method for producing an optoelectronic component which emits a useful radiation, comprising the steps of:

providing a luminescence diode chips;

measuring the radiant intensity or luminous intensity emitted by the luminescence diode chip;

providing a composition which is transmissive to the useful radiation and which is admixed with radiation-absorbing particles;

selecting in a targeted manner a concentration of the radiation-absorbing particles in the composition depending on the measured radiant intensity or luminous intensity of the luminescence diode chip, for setting a radiant intensity or luminous intensity to be obtained in the component; and

arranging the composition which is transmissive to the useful radiation in a beam path of the electromagnetic radiation emitted by the luminescence diode chip during the operation thereof.

16. The method according to claim 15,

in which the luminescence diode chip is encapsulated or surrounded by the composition which is transmissive to the useful radiation.

17. The method according to claim 15, in which a composition which is transmissive to the useful radiation and which also has at least one phosphor besides the radiation-absorbing particles is provided,

and in which the concentration of the phosphor in the composition is selected in a targeted manner depending on the selected concentration of the radiation-absorbing particles, for setting a colour locus to be obtained of the useful radiation to be emitted by the component.

18. The method according to claim 15, further comprising the steps of:

providing a housing basic body having a housing cavity,

mounting the luminescence diode chip in the housing cavity, and

at least partly potting the housing cavity with the composition which is transmissive to the useful radiation.

19. The method according to claim 15,

in which a component is provided which contains the luminescence diode chip and which has a housing body having an exterior area, the composition which is transmissive to the useful radiation being applied to the exterior area of the housing body.

20. The method according to claim 19, in which the composition which is transmissive to the useful radiation is provided prior to application on the exterior area in the form of a prefabricated material layer.

21. The method according to claim 19,

in which the composition which is transmissive to the useful radiation is provided prior to application on the exterior area in the form of a foil.